Huawei Technologies Co., Limited

Jilin University

Changyi Liu

Hongwei Zhao

Luquan Ren

Zhichao Ma

Nengwu Xiang

Xidong Yao

Jingshi Dong

Zunqiang Fan

Kun Hong

Xudong Fei

Fu Zhang

Yong Hu

Zhihui Zhang

Jiwen Sun

Yongchen Zhou

Xianhua Liu

Zhuang Ren

Yuansen Qiao

A communications device is disclosed, the device includes a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.

Communications device and board used in communications device

A heat dissipation system used for a communications device is disclosed, where the communications device includes a chassis, a network board, a service board, a backplane, and a high-rate cable; the chassis is configured to house the network board, the service board, the backplane, and the high-rate cable; the backplane is vertically inserted in a middle part or a middle rear part of the chassis, and parallel to a front side of the chassis; the service board and the network board are parallel and are connected to a front side of the backplane; the high-rate cable is connected between the network board and the service board on a rear side of the backplane; and the heat dissipation system further includes multiple fans that are installed in an array form on a rear side of the chassis, and an air vent that penetrates through the backplane.

Heat dissipation system and communications device

Growing community of inventors

Shenzhen, China

Changyi Liu