Sharp Laboratories of America, Inc

Elux, Inc.

Sharp Kabushiki Kaisha Corporation

Ehux, Inc.

Changqing Zhan

Paul John Schuele

Mark Albert Crowder

Kurt M Ulmer

Kenji Alexander Sasaki

Sean Mathew Garner

John Hartzell

Timothy James Kiczenski

David Robert Heine

Avinash Tukaram Shinde

Karen Yuri Nishimura

Michael Barrett Wolfson

Jong-Jan Lee

John F Conley, Jr

Wei Pan

Jiandong Huang

Hao-Chih Yuan

Liang Tang

Chang-Ching Tu

A method is provided for fabricating piezoelectric plates. A sacrificial layer is formed overlying a growth substrate. A template layer, with openings exposing sacrificial layer surfaces, is formed over the sacrificial layer. An adhesion layer/first electrode stack is selectively deposited in the openings overlying the sacrificial layer surfaces, and a piezoelectric material formed in the openings overlying the stack. Then, a second electrode is formed overlying the piezoelectric material. Using the second electrode as a hardmask, the piezoelectric material is etched to form polygon-shaped structures, such as disks, attached to the sacrificial layer surfaces. After removing the template layer and annealing, the polygon-shaped structures are separated from the sacrificial layer. With the proper choice of growth substrate material, the annealing can be performed at a relatively high temperature.

Method for the fabrication and harvest of piezoelectric plates

Planar surface mount (SM) micro light emitting diodes (&#x3bc;LEDs) are presented. The fabrication method provides a MOCVD LED structure with a stack including a first doped semiconductor in a first plane, a MQW layer overlying the first doped semiconductor in a second plane, and a second doped semiconductor overlying the MQW layer in a third plane. An electrical insulator is conformally deposited over the etched stack in a fourth plane, and etched to expose the second doped semiconductor, creating a first via. Etching exposes the first doped semiconductor, creating a second via. A first electrode is connected to the second doped semiconductor through the first via, and has a substrate interface surface in a fifth plane with an average planarity tolerance of less than 10 nanometers. A second electrode is connected to the first doped semiconductor through the second via, and has a substrate interface surface in the fifth plane.

Planar surface mount micro-LED for fluidic assembly

A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.

Counterbore pocket structure for fluidic assembly

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Diodes offering asymmetric stability during fluidic assembly

Emissive display substrate for surface mount micro-LED fluidic assembly

Embodiments are related to systems and methods for forming and using a top-contact disk.

Fluidic assembly top-contact LED disk

Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

Substrate with topological features for steering fluidic assembly LED disks

A method is provided for fabricating a thin-film electronic device employing a piezoelectric plate. The method provides a plurality of piezoelectric plates, and a substrate with electronic devices, each electronic device including a top surface well. A piezoelectric plate suspension is formed and flowed over the substrate. In response to the piezoelectric plate suspension flow, piezoelectric plates are captured in the top surface wells. The electric device top surface wells have well bottom surfaces, with bottom electrical contacts formed on the bottom surfaces. Thus, the capture of a piezoelectric plate in a top surface well entails interfacing a piezoelectric plate electrode, either the first electrode or the second electrode, to the bottom electrical contact. Subsequent to capturing the piezoelectric plates in the top surface wells, a thin-film process forms a conductive line overlying the exposed piezoelectric device electrode (i.e., the electrode not connected to the bottom electrical contact).

Fluidic assembly process using piezoelectric plates

A method is provided for forming a direct emission display. The method provides a transparent substrate with an array of wells formed in its top surface. A fluid stream is supplied to the substrate top surface comprising a plurality of top-contact light emitting diode (LED) disks. The wells are filled with the LED disks. A first array of electrically conductive lines is formed over the substrate top surface to connect with a first contact of each LED disk, and a second array of electrically conductive lines is formed over the substrate top surface to connect with a second contact of each LED disk. An insulator over the disk exposes an upper disk (e.g., p-doped) contact region. A via is formed through the disk, exposing a center contact region of a lower (e.g., n-doped) disk contact region. Also provided are a top-contact LED disk and direct emission display.

Fabrication and harvest of piezoelectric plates

Embodiments are related to systems and methods for fluidic assembly, and more particularly to diodes offering orientation control properties in a fluidic assembly system.

Formation and structure of post enhanced diodes for orientation control

A bi-stable micro-electrical mechanical system (MEMS) heat harvester is provided. A bi-stable MEMS cantilever located between a hot temperature surface and a cold temperature surface, and is made up of a first MEMS material layer, having a first coefficient of thermal expansion. A second MEMS material layer is in contact with the first MEMS material layer, and has a second coefficient of thermal expansion less than the first coefficient of thermal expansion. A tensioner, made from a material having a tensile stress greater than the stress of the first or second MEMS materials, is connected to the cantilever. The heat harvester also includes a mechanical-to-electrical power converter, which may be a piezoelectric device or an electret device. The bi-stable MEMS cantilever may include a thermal expander having a coefficient of thermal expansion greater than the second coefficient of thermal expansion. The thermal expander is connected to the tensioner.

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Vancouver, WA, United States of America

Changqing Zhan