Zhejiang Jinko Solar Co., Ltd

Shanghai Jinko Green Energy Enterprise Management Co., Ltd.

Jinko Solar Co., Ltd.

Jinko Green Energy (shanghai) Management Co., Ltd.

Changming Liu

Xinyu Zhang

Jingsheng Jin

Bike Zhang

Kun Yu

Dong Wang

Xunlei Yan

Zengzhi Ma

Beibei Gao

Pengsong Zhao

Chao Zhou

Provided is a photovoltaic solar cell, a solar cell module and a manufacturing process. The photovoltaic solar cell includes a silicon substrate, and a passivation layer located on at least one surface of the silicon substrate. An electrode, an electrode pad and an extension line are printed on at least one surface of the silicon substrate. The electrode includes a busbar and a finger crossed with each other, and the finger is in contact with the silicon substrate. Two ends of the extension line are respectively connected to the busbar and the electrode pad, to reinforce a connection between the busbar and the electrode pad such that the extension line is not in direct contact with the finger, the extension line is in contact with the passivation layer, the electrode pad and the busbar are not in direct contact with the silicon substrate.

Photovoltaic solar cell, solar cell module and manufacturing process

Disclosed is a barrier-type photovoltaic solder strip capable of reducing damp-heat (DH) attenuation, the photovoltaic solder strip comprising a photovoltaic solder strip body. A moisture barrier layer is arranged on a surface of the photovoltaic solder strip body that is not in contact with an electrode of a solar cell, and the moisture barrier layer can prevent external water and gas from entering the photovoltaic solder strip body, thus, on the basis of low cost, corrosion of the photovoltaic solder strip body by acidic substances, oxidizing agents and water in a module is reduced, thereby reducing attenuation of a photovoltaic module in a DH environment.

Barrier-type photovoltaic welding strip capable of reducing damp-heat attenuation

A solar cell, a method for manufacturing solar cell, and a photovoltaic module. The solar cell includes: a semiconductor substrate; a tunneling layer located over a rear surface of the semiconductor substrate; a hydrogen barrier layer located over a surface of the tunneling layer; a lightly doped conductive layer located over a surface of the hydrogen barrier layer; and grid-shaped doped conductive layers located on at least part of a surface of the lightly doped conductive layer, wherein each of the grid-shaped doped conductive layers includes a heavily doped conductive layer and a metal barrier layer that are stacked on one another.

Solar cell and method for manufacturing solar cell, and photovoltaic module

Provided are a solar cell, including: a semiconductor substrate, in which a rear surface of the semiconductor substrate having non-pyramid-shaped microstructures, the non-pyramid-shaped microstructures include two or more first substructures at least partially stacked on one another, and a one-dimensional size of the surface of the outermost first substructure is less than or equal to 45 μm; a first passivation layer located on a front surface of the semiconductor substrate; first and second tunnel oxide layers located on the non-pyramid-shaped microstructures; first and second doped conductive layers located on a surface of the first and second tunnel oxide layers, the first and second doped conductive layer has different conductive types; a second passivation layer located on a surface of the first and second doped conductive layers; and electrodes formed by penetrating through the second passivation layer to be in contact with the first and second doped conductive layers.

Solar cell, manufacturing method thereof, and photovoltaic module

Provided are a solar cell, a manufacturing method thereof, and a photovoltaic module. The solar cell includes: a semiconductor substrate, in which a rear surface of the semiconductor substrate having a first texture structure, the first texture structure includes two or more first substructures at least partially stacked on one another, and in a direction away from the rear surface and perpendicular to the rear surface, a distance between a top surface of an outermost first substructure and a top surface of an adjacent first substructure being less than or equal to 2 μm; a first passivation layer located on a front surface of the semiconductor substrate; a tunnel oxide layer located on the first texture structure; a doped conductive layer located on a surface of the tunnel oxide layer; and a second passivation layer located on a surface of the doped conductive layer.

Provided are a solar cell, a manufacturing method thereof, and a photovoltaic module. The solar cell includes: a semiconductor substrate, in which a rear surface of the semiconductor substrate having a first texture structure, the first texture structure includes two or more first substructures at least partially stacked on one another, and a one-dimensional size of the top surface of the outermost first substructure is less than or equal to 45 &#x3bc;m; a first passivation layer located on a front surface of the semiconductor substrate; a tunnel oxide layer located on the first texture structure; a doped conductive layer located on a surface of the tunnel oxide layer, the doped conductive layer includes a P-type doped conductive layer and an N-type doped conductive layer; and a second passivation layer located on a surface of the doped conductive layer.

Provided are a solar cell, a manufacturing method thereof, and a photovoltaic module. The solar cell includes: a semiconductor substrate, in which a rear surface of the semiconductor substrate having a first texture structure, the first texture structure includes two or more first substructures at least partially stacked on one another, and in a direction away from the rear surface and perpendicular to the rear surface, a distance between a top surface of an outermost first substructure and a top surface of an adjacent first substructure being less than or equal to 2 &#x3bc;m; a first passivation layer located on a front surface of the semiconductor substrate; a tunnel oxide layer located on the first texture structure; a doped conductive layer located on a surface of the tunnel oxide layer; and a second passivation layer located on a surface of the doped conductive layer.

Provided is a composite encapsulating material and a photovoltaic module encapsulated with the composite encapsulating material, which relate to the technical field of photovoltaic modules. At least a partial area of the composite encapsulating material includes a high insulation material, and the high insulation material includes polyimide, modifier and modified polyimide. The above technical solution can improve an insulation performance of the encapsulating material, reduce a blank area of an edge of the module, reduce a weight of the photovoltaic module, and further reduce comprehensive cost of the photovoltaic module.

Composite encapsulating material and photovoltaic module including the same

Provided is a photovoltaic solar cell, a solar cell module and a manufacturing process. The photovoltaic solar cell includes a silicon substrate, and a passivation layer located on at least one surface of the silicon substrate. An electrode, an electrode pad and an extension line are printed on at least one surface of the silicon substrate. The electrode includes a busbar and a finger crossed with each other, and the finger is in contact with the silicon substrate. Two ends of the extension line are respectively connected to the busbar and the electrode pad, and the extension line is in contact with the silicon substrate.

Provided are a solar cell, a manufacturing method thereof, and a photovoltaic module. The solar cell includes: a semiconductor substrate, in which a rear surface of the semiconductor substrate having a first texture structure, the first texture structure includes two or more first substructures at least partially stacked on one another, and in a direction away from the rear surface and perpendicular to the rear surface, a distance between a top surface of an outermost first substructure and a top surface of an adjacent first substructure being less than or equal to 2&#x3bc;m; a first passivation layer located on a front surface of the semiconductor substrate; a tunnel oxide layer located on the first texture structure; a doped conductive layer located on a surface of the tunnel oxide layer; and a second passivation layer located on a surface of the doped conductive layer.

Growing community of inventors

Zhejiang, China

Changming Liu