Samsung Electronics Co., Ltd.

Changkyu Chung

Kyungwoon Jang

Changjoon Lee

Daesuck Hwang

Gyun Heo

Soonmin Hong

Sungyong Min

Byunghoon Lee

Kwangrae Jo

Tackmo Lee

Youngjun Moon

Jamyeong Koo

Youngkyong Jo

Wonsoon Park

A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.

Display module, display apparatus and method for manufacturing the same

A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.

Display module

A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.

Micro LED display and manufacturing method with conductive film

A method of manufacturing a micro light emitting diode (LED) display module includes stacking a connecting layer onto a transfer substrate on which a micro LED is disposed; positioning the transfer substrate above a display substrate, in which a plurality of thin-film transistors are formed, so that the micro LED faces the display substrate; transferring, to the display substrate, the micro LED and a connecting member that is in contact with the micro LED and is separated from the connecting layer by using a laser transfer method; and heating the micro LED and compressing the micro LED against the display substrate to bond the micro LED to the display substrate by the connecting member.

Micro LED display module and method of manufacturing the same

A method of manufacturing a micro light emitting diode (LED) display module. The method of manufacturing a micro LED display module may include: pressing a plurality of micro LEDs disposed on a substrate to which an adhesive layer is applied, to electrically connect the plurality of micro LEDs to electrode pads of the substrate; performing testing to detect whether at least one of the plurality of micro LEDs is defective in a state in which the plurality of micro LEDs are pressurized and the adhesive layer is uncured; and based on detecting that at least one of the plurality of micro LEDs is defective, performing control to harden the adhesive layer.

Micro LED display module with excellent color tone and high brightness

A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.

Display module and manufacturing method thereof

A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.

Growing community of inventors

Suwon-si, South Korea

Changkyu Chung