Samsung Electronics Co., Ltd.

Changhwi Park

Jungmin Bak

Junyoung Ko

A CXL device includes at least one memory; a CXL controller configured to receive a request to access the at least one memory via a CXL interface, and to output a memory identifier indicating a first memory of the at least one memory, a command and a row address of the first memory based on the request; and a refresh controller configured to store the row address as a target row address of the first memory and further configured to generate a targeted refresh signal based on a number of receptions of the command for refreshing the target row address in the first memory.

CXL device and operation method of CXL device

A memory device includes a memory cell array including a plurality of memory cells, a word line defect detection circuit electrically connected to the memory cell array through a plurality of word lines, and control logic configured to control an input/output operation of the memory cell array. When a memory defect detection command is received from a memory controller, the word line defect detection circuit is configured to provide an input voltage to a selected word line among the plurality of word lines, and to generate a fail flag based on a difference between a voltage of the selected word line and a reference voltage. When a mode register read command is received from the memory controller, the control logic is configured to transmit the fail flag and a fail row address corresponding to the fail flag to the memory controller.

Memory device included in memory system and method for detecting fail memory cell thereof

A test device includes a power supply circuit that is configured to supply an input voltage through a power voltage pin to a memory device under test, and a test controller, which is configured to: (i) transmit a command signal to the memory device, (ii) measure a first current flowing to the memory device through the power voltage pin at a first time point after transmitting the command signal, (iii) measure a second current flowing to the memory device through the power voltage pin at a second time point, which is different from the first time point, and (iv) compare the measured first current to the measured second current to thereby determine whether the memory device has a defect therein.

Test devices and systems that utilize efficient test algorithms to evaluate devices under test

A row decoder circuit includes a first transistor connected to a power supply node and a first node; a plurality of second nodes connected in parallel between the first node and a power ground node, each of the plurality of second nodes being connected to a corresponding word line among the plurality of word lines; a plurality of second transistors connected between the first node and the plurality of second nodes; a plurality of third transistors connected between the plurality of second nodes and a power ground node; a comparator outputting a detection signal by receiving a voltage of the first node and a reference voltage. In a pre-charging period, the first transistor is turned on, the plurality of second transistors are turned on, and the third transistors are turned off, so that the first node and the plurality of second nodes are charged. In a development period, the first transistor maintains a turned-on state, the plurality of second transistors are turned off, and each of the second nodes is discharged at a different rate depending on whether current of the corresponding word line is leaked, and in a sensing period, the first transistor is turned off, the plurality of second transistors are turned on, and the first node is selectively discharged according to voltage levels of the discharged second nodes.

Row decoder circuit, memory device and memory system

A semiconductor device may include: a memory device that includes a memory cell, a page buffer, and a first switch having a first end that is electrically connected to a first node located at a bonding point of the memory cell and a second end that is connected to a second node located at the page buffer; and a memory controller that is configured to apply a pre-charge voltage to the first node and the second node in a first period, to close the first switch in a second period following the first period, and is configured to determine whether bonding between the memory cell and the first switch is defective based on a voltage of the second node after the first switch is closed.

Bonding defect detection for die-to-die bonding in memory devices

A volatile memory device includes an array of memory cells connected to word lines, and bit lines, which are connected to a bitline sense amplifier. Control logic is provided, which is configured to control: (i) consecutive self-refresh operations within the array of memory cells, (ii) storage of dummy data within the array of memory cells during operations to predict life expectancy of memory cells therein, (iii) consecutive test refresh operations within the array of memory cells, and (iv) performance of test sensing operations on selected memory cells within the array using the bitline sense amplifier. A deterioration detection circuit is provided, which is configured to receive sensing results associated with the selected memory cells from the bitline sense amplifier.

Volatile memory devices and methods of operating same to improve reliability

A defense method of a memory device according to an embodiment includes obtaining a plurality of defense types to refresh a row of a memory cell array that is subjected to an attack, determining respective operation times for the defense types, and performing a refresh operation for the row of the memory cell array by switching among the defense types based on the respective operation times that were determined.

Memory device and defense method thereof

A memory device may include a time counter which is configured to output a count signal according to a predetermined time interval; a use history circuit which is configured to write an operating time value based on the count signal and generate and write a validation value corresponding to the operating time value; and a command decoder which is configured to receive an instruction from a memory controller. The instruction may be according to an operation mode that is determined based on the operating time value and the validation value.

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Suwon-si, South Korea

Changhwi Park