Therm-o-disc, Incorporated

Changcai Zhao

Lijuan Huang

Xiang Gong

Rong Guan

Guojun Xiao

Qiang Zhao

Katherine Hinrichs

Shi Wei

Wei Shi

Kangsheng Lin

Hongfang Xie

A temperature fuse assembly for a high-power DC circuit is provided. The temperature fuse assembly includes a case extending from a first case end to a second case end and an isolated lead projecting from the second case end. A bushing electrically isolates the isolated lead from the case. A high-gauge wire is electrically connected to the case at a first wire end and electrically connected to the isolated lead at a second wire end. A portion of the high-gauge wire is helically wound about an exterior of the bushing. When a temperature of the temperature fuse assembly exceeds a threshold temperature, the temperature fuse assembly is configured to conduct a DC current of the high-power DC circuit through the high-gauge wire. The high-gauge wire is configured to melt under a load of the DC current and interrupt the high-power DC circuit.

Thermal cut-off device for high power applications

Provided is a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound have low ionization potential, such as dibenzosuberenone. The solid pellet maintains its structural rigidity up to a transition temperature (T), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (T), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 160&#xb0; C. greater than the T. The aging performance is further enhanced. Further, methods of enhanced processing and pelletizing are provided.

High thermal stability thermal cutoff device pellet composition

The present disclosure provides a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. Certain inorganic stability additive particles, such as silica, talc, and siloxane, can be mixed with one or more organic compounds to form a thermal pellet composition. A solid thermal pellet maintains its structural rigidity up to a transition temperature (T), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (T), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 50&#xb0; C. greater than the T. In certain variations, maximum dielectric capability temperature (T) is greater than or equal to about 380&#xb0; C.

High thermal stability pellet compositions for thermal cutoff devices and methods for making and use thereof

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Zhuhai, China

Changcai Zhao