Samsung Electronics Co., Ltd.

Changbae Lee

Myungsam Kang

Youngchan Ko

Bongju Cho

Yongkoon Lee

Moonil Kim

Younggwan Ko

Kihuk Lee

Dongsoo Kim

Jonghoon Won

Youngkwon Yoon

Hwayong Kang

Shuichi Shimokawa

Yeotak Youn

Kawang Kang

Yeongeun Kim

A semiconductor package includes: a connection structure having a first surface and a second, and including a redistribution layer; a passive component disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a semiconductor chip disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a first encapsulant disposed on the first surface of the connection structure and covering at least a portion of the semiconductor chip; a second encapsulant disposed on the first surface of the connection structure and covering at least a portion of the passive component; an antenna substrate disposed on the first encapsulant and including a wiring layer, at least a portion of the wiring layer including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the first encapsulant, and the antenna substrate.

Semiconductor package

A semiconductor package includes: a connection structure including one or more redistribution layers; a core structure disposed on a surface of the connection structure; a semiconductor chip disposed on the surface and including connection pads electrically connected to the redistribution layers of the connection structure; a first encapsulant disposed on the surface and covering at least a portion of each of the core structure and the semiconductor chip; an antenna substrate disposed on the first encapsulant and including one or more wiring layers, at least a portion of the wiring layers including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the core structure, the first encapsulant, and the antenna substrate.

According to various embodiments, an electronic device includes an image sensor, a memory, and a processor. The processor is configured to control the electronic device to: obtain a plurality of image frames including external light and an external object at a first designated frame rate using the image sensor, based on a capturing signal; identify a frequency of a flicker related to the external light source; generate first section images for at least a part of a time for which the plurality of image frames are obtained using frames selected from the plurality of image frames corresponding to a second designated frame rate based at least on the frequency, the second designated frame rate being lower than the first designated frame rate; generate second section images for at least a part of the time for which the plurality of image frames are obtained in response at least to a designated input using image frames obtained at the first designated frame rate after the designated input from among the plurality of image frames; and generate moving image data including at least the first section images and the second section images.

Apparatus and method for generating moving image data including multiple section images in electronic device

Growing community of inventors

Suwon-si, South Korea

Changbae Lee