Boe Technology Group Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Ordos Yuansheng Optoelectronics Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Hefei Boe Optoelectronics Technology Co., Ltd.

Huaneng Clean Energy Research Institute

Shanghai Saiyuan Bio-technology Co., Ltd.

Chang Zhang

Yong Yu

Lixia Shen

Zhiguang Zhang

Jianjun Wu

Jiangsheng Wang

Xuerui Gong

Kwanggyun Jang

Qun Jia

Hongqiang Luo

Qing Gong

Biyu Zhao

Jing Liu

Shuang Zhang

Chuanyan Lan

Hualing Yang

Tairong Kim

Shanfu Jiang

Tae Hyun Kim

Lei Zhang

Hao Sun

Kun Li

Qi Liu

Bin Wu

Xiaoxia Huang

Shuang Hong Wang

Hui Lu

Yuanyuan Chai

Teng Chen

Bing Ji

Huan Zhang

Feng Xiao

Jin Hu

Jinyi Wang

Taehyun Kim

Pengjie Wang

Xianming Xu

Shimin Pu

Zhuyi Luo

Chuanyong Li

Shuang Wang

Yongle Wang

Jiaqin Zhang

Jiuru Sun

Weihong Wu

Dehua Zhang

Wenhong Liu

Renjie Ding

Wenli Xiao

Zhiwei Sun

Weiyi Qiu

Tiejiong Fan

Zhenwen Hu

Ge Sun

Zhibo Ren

A display panel and a display apparatus. The display panel includes a display substrate, a first printed circuit board and a second printed circuit board, wherein the display substrate includes a display area and a bonding area located on a side of the display area, the bonding area is connected with the first printed circuit board through a first flexible printed circuit, and the first printed circuit board is connected with the second printed circuit board through a second flexible printed circuit; and the first printed circuit board is a wiring circuit board mounted with a signal connection line, the second printed circuit board is a drive circuit board mounted with a drive chip, and an orthographic projection of the second printed circuit board on a plane of the display panel does not overlap with an orthographic projection of the display substrate on the plane of the display panel.

Display panel and display apparatus

The present disclosure relates to a flip-chip and a chip packaging structure. The flip-chip includes: a driver chip having a package surface facing a wiring substrate; and a plurality of conductive connectors. Any one of the plurality of conductive connectors includes a conductive bump connected to the package surface and a conductive extension portion on a side of the conductive bump away from the driver chip.

Flip chip and chip packaging structure

A display module (), including a drive IC () and a power management IC (). The power management IC () comprises a first identification pin (); the first identification pin () is connected to the drive IC (); under the condition that the power management IC () is turned on, the power management IC () transmits identification information to the drive IC () by means of the first identification pin (), so that the drive IC () identifies the power management IC () and is paired with the power management IC (). A control method, a control apparatus (), an electronic device () and a computer readable storage medium ().

Display module, control method and apparatus, electronic device, and storage medium

A display apparatus and an electronic device. The display apparatus includes a flexible display panel, a plurality of driver integrated circuits, a logic board, and a circuit board. The driver integrated circuits are disposed on a first surface of the flexible display panel and on a peripheral region; and the circuit boards is electrically connected to the driver integrated circuits and the logic board, respectively. A first bendable section of the circuit board is configured to be bent to a second surface of the flexible display panel along a first side edge; a second bendable section of the circuit board is configured to be bent at a side where the second surface is disposed, such that the logic board protrudes from the first side edge; and a third bendable section of the circuit board is configured to bypass a hinge shaft of the electronic device.

Display apparatus and electronic device

A pixel circuit includes a driving circuit, an energy storage circuit, a first control circuit, a first reset circuit and a data writing-in circuit; the first control circuit is configured to control to connect the second node and a first terminal of the driving circuit under the control of a light-emitting control signal; the first reset circuit is configured to write a reference voltage into the second node under the control of a first reset control signal; the data writing-in circuit is configured to write a data voltage into the first terminal of the driving circuit under the control of a scan signal; the driving circuit is configured to control to connect the first terminal of the driving circuit and the second terminal of the driving circuit under the control of the control terminal of the driving circuit.

Pixel circuit, driving method, display substrate and display device

The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.

Display device

Embodiments of the application provide a printed circuit board, a display module, a display device and a method of bonding the printed circuit board to a display screen. The printed circuit board includes a plurality of sub-circuit boards and a flexible connector between adjacent sub-circuit boards of the plurality of sub-circuit boards. The flexible connector is configured to connect the adjacent sub-circuit boards of the plurality of sub-circuit boards with each other. For the printed circuit board provided in the embodiments of the application, each sub-circuit board of the printed circuit board can be bonded independently, thereby avoiding pitch accumulation in the bonding region and thus controlling the total pitch within a satisfactory range.

Printed circuit board, display module comprising the printed circuit board, display device and method of bonding the printed circuit board

A method for preparing a COF-protected electrode and an electrode are provided. The method includes mixing an organic framework, a small molecular organic acid and a solvent, adding a polar aqueous solution containing a substrate thereto, mixing the above uniformly and heating the system at a low temperature under an inert atmosphere, filtering the solution to obtain precipitates, washing and drying the precipitates to obtain a COF film grown on a surface of the substrate; coating a protective layer on the COF film to obtain a substrate/COF/protective layer film; etching off the substrate to obtain a COF/protective layer film; and transferring the COF/protective layer film to a surface of the electrode, and removing the protective layer.

Method for preparing COF-protected electrolytic hydrogen production electrode

Provided is an array substrate. The array substrate includes: a base substrate, and a plurality of gate lines, a plurality of data lines, a plurality of sub-pixels and a plurality of touch signal lines disposed on the base substrate. The data lines have a plurality of first extending parts and a plurality of second extending parts which are in an alternating arrangement. When the array substrate is used to prepare a liquid crystal display panel and the liquid crystal display panel is displaying, in each column of the sub-pixels, the voltage polarities of the two adjacent sub-pixels which respectively belong to two adjacent first pixel regions are opposite.

A display panel and a manufacturing method thereof, and a display device are provided. The display panel includes: a substrate; a plurality of light-emitting elements and an encapsulation layer disposed on the substrate, with the plurality of light-emitting elements located between the encapsulation layer and the substrate; a transfer layer disposed on a side of the encapsulation layer away from the substrate and bonded to the encapsulation layer, with an adhesive force between the transfer layer and the encapsulation layer greater than that between an organic adhesive layer and the encapsulation layer, and the organic adhesive layer configured to react chemically under a preset catalytic condition to be formed to the transfer layer; and a touch structure () disposed on a side of the transfer layer away from the substrate and configured to detect occurrence of a touch action.

Display panel and manufacturing method thereof, and display device

Chip on flex, touch assembly, and display device

The present disclosure provides a method for driving a display device and a driver. The method includes obtaining image data, determining whether the image pixels are detail pixels according to the image data, determining a plurality of screen pixel groups, and driving the screen pixels for display.

Method for driving display device and driver

Disclosed are a driving circuit for a display panel, a display module, a compensation method of the display module, and a display device. According to the present disclosure, a TCON circuit board provided with a plurality of sets of reference voltage outputs is used to independently input a reference voltage to each driver chip through a corresponding set of reference voltage input lines, that is, each driver chip receives an independent reference voltage signal, in this way, the reference voltages output by the TCON circuit board corresponding to each driver chip can be adjusted, the reference voltages received by all driver chips are made to be the same voltages.

Driving circuit for display panel, display module, compensation method of display module and display device

A display panel, a display device, and a method for manufacturing a display panel are disclosed. The display panel includes a first power bus and a first power line. A display region of the display panel includes a first region and a second region, the first region and the second region include a plurality of first pixel units, respectively, the first power bus is between the first region and the second region, and the first power line is electrically connected to the first power bus and extends from the first power bus to the first region and the second region, respectively, so as to supply power to the plurality of first pixel units in the first region and the second region, respectively.

Display panel, display device, and method for manufacturing display panel

The disclosure provides a bonding method, the bonding method includes: bonding first areas of a plurality of flexible printed circuit boards on a substrate, the plurality of flexible printed circuit boards being sequentially arranged along a direction parallel to a first side of the substrate, and a second area of each of the flexible printed circuit boards exceeds the first side; cutting at least one of the flexible printed circuit boards to enable second sides of all the flexible printed circuit boards to be flush and parallel to the first side, wherein each of the second sides is a side of the second area away from the first area; and bonding second areas of the flexible printed circuit boards with a connection circuit board.

Bonding method

Growing community of inventors

Beijing, China

Chang Zhang