Advanced Semiconductor Engineering, Inc.

Sunonwealth Electric Machine Industry Co., Ltd.

Woodmax Ky Industries Corp.

National Sun Yat-sen University of Kaohsiung

Chang-Yu Lin

Chi-Han Chen

Chih-Pin Hung

Cheng-Yuan Kung

Hung-Yi Lin

Mei-Ju Lu

Jr-Wei Lin

Cheng-Hsuan Wu

Guan-Ming Chen

Yu-Sheng Huang

Chieh-Chen Fu

Li-Yang Lyu

Alex Horng

I-Yu Huang

Yu-Hung Chen

Jui-Feng Wang

An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.

Optoelectronic package structure and method of manufacturing the same

An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Electronic device package and method for manufacturing the same

A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

Semiconductor package device method of manufacturing the same

A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

Semiconductor package structure

A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

System comprising packaged optical devices

A semiconductor device package includes a redistribution layer (RDL), a semiconductor device, a transceiver, and a capacitor. The RDL has a first surface and a second surface opposite to the first surface. The semiconductor device is disposed on the first surface of the RDL. The transceiver is disposed on the second surface of the RDL. The capacitor is disposed on the second surface of the RDL. The semiconductor device has a first projected area and the capacitance has a second projected area. The first projected area overlaps with the second projected area.

Semiconductor device packages and methods of manufacturing the same

Semiconductor package device and method of manufacturing the same

A motor includes a base, a winding assembly and a rotor. The base includes a pivoting portion. The winding assembly includes a support. The support includes at least one coil supporting portion and a circuit supporting portion connected to the at least one coil supporting portion. A coil is arranged on each of the at least one coil supporting portion. A circuit is arranged on the circuit supporting portion and electrically connected to the coil or coils. A folding portion is arranged between the at least one coil supporting portion and the circuit supporting portion. The circuit supporting portion and the at least one coil supporting portion are folded and stacked together via the folding portion. The rotor is rotatably coupled to the pivoting portion of the base. Due to the arrangement of the folding portion, a radial width of the motor is efficiently reduced.

Motor and winding assembly thereof

The present invention provides a motor winding assembly including a flexible base plate and a winding assembly. The flexible base plate includes a plurality of supports. A bridge is connected between adjacent two of the plurality of supports. Each of the plurality of supports has a center, and the flexible base plate has a reference line extending through the centers of the plurality of supports. The bridge is not located on the reference line. The winding assembly includes a plurality of winding units. Each of the plurality of supports is provided with at least one winding unit. An electrical path is located on the bridge between the adjacent two of the plurality of supports and electrically connected to the winding units of the adjacent two of the plurality of supports. In this arrangement, the total length of the flexible base plate is reduced.

Motor winding assembly

A motor winding structure includes a base plate is disclosed. The base plate includes a board having a winding unit. The winding unit includes a plurality of coils formed on the surface of the board by electroforming or layout. Each coil has a center, and includes an inner end adjacent to the center and an outer end distant to the center. Two adjacent coils are connected to each other via the inner ends. The winding unit further includes an insulating layer and a conducting layer. The inner ends of the two coils are connected to an electrical connection pad. The insulating layer is arranged on the board. The two adjacent coils are covered by the insulating layer. The conducting layer extends through the insulating layer and is connected to the electrical connection pads of the two coils. The two coils are connected to each other via the inner ends.

Motor winding structure

A manufacturing method for a Zinc Oxide (ZnO) piezoelectric thin-film with high C-axis orientation comprises the steps of providing a substrate having a base, a SiOlayer and a SiNlayer; forming a bottom electrode layer on the SiNlayer; patterning the bottom electrode layer; sputtering a Zinc Oxide layer on the SiNlayer and the bottom electrode layer; forming a photoresist layer on the SiNlayer and the Zinc Oxide layer; patterning the photoresist layer to reveal the Zinc Oxide layer; forming a top electrode layer on the Zinc Oxide layer and the photoresist layer; removing the photoresist layer and the top electrode layer formed on the photoresist layer, and the top electrode layer formed on the Zinc Oxide layer can be remained; and patterning the SiNlayer to form a recess that reveals the base of the substrate.

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Kaohsiung, Taiwan

Chang-Yu Lin