Intel Corporation

Chang-Wu Yen

Tawfik M Rahal-Arabi

Prashant Sethi

Anthony M Constantine

Jimmy Y Hsiao

Celia H Yang

Alesi Hung

Ching-Shan Cheng

Tawfik M Rhal-Arabi

Yu-Liang Shiao

Yu Liang Shiao

Moss Weng

Modular power delivery techniques for electronic devices are described. In one embodiment, an apparatus may comprise native power delivery circuitry to source a native power delivery current, power management circuitry to control the native power delivery circuitry, a power delivery connector to mate with a counterpart power delivery connector of an external device, and a processing device conductively coupled to the power delivery connector via a supplemental power delivery line, the processing device to draw a supplemental power delivery current from the external device via the supplemental power delivery line. Other embodiments are described and claimed.

Modular power delivery techniques for electronic devices

Examples include techniques for dynamically modifying a platform form factor of a mobile device. In some examples, a system may include a split memory array having a first memory within a docking system and a second memory element within a small form factor (SFF) mobile device. A platform form factor determination component may dynamically select between multiple platform form factors based on a determination that the SFF mobile device is coupled with the docking system. An interface logic component may access the first memory storage of the docking system during a memory (e.g., graphics) computation when the mobile device is physically and electrically/communicably coupled with the docking system to allow the SFF mobile device to have full LFF functionality. When the SFF mobile device is disconnected from the docking system, the interface logic component may access only the second memory storage of the SFF mobile device to provide SFF functionality.

Techniques for dynamically modifying platform form factors of a mobile device

Embodiments are generally directed to an adjustable gap structure for mobile devices. An embodiment of a mobile device includes a cover; a printed circuit board including a processing component and thermal solution, the printed circuit board being movable along a first axis towards or away from the cover to provide an adjustable air gap; one or more ferromagnetic elements coupled with the printed circuit board; and one or more magnets, wherein, in first mode, the one or more magnets are to attract the one or more ferromagnetic elements and maintain an air gap of a first distance between the thermal solution and the cover, and wherein, in a second mode, an external magnetic force is to pull the ferromagnetic elements away from the one or more magnets and reduce the air gap between the thermal solution and the cover.

Adjustable air gap for mobile devices

A power delivery architecture for a computing system is described. In one embodiment, an apparatus comprises a docking station; and a computing system removably coupled to the docking station and having a plurality of components and a power delivery subsystem to deliver power to integrated circuit (IC) components under direction of a controller, where the controller is communicably coupled to the docking station when the docking station is coupled to the computing system to cause power from the docking station to be delivered to at least one of the components with power from the power delivery system.

Power delivery architecture to increase performance of computing systems when docked

Growing community of inventors

Taipei, Taiwan

Chang-Wu Yen