Intel Corporation

National Yang Ming Chiao Tung University

Chang-Tsung Fu

Telesphor Kamgaing

Stewart S Taylor

Ping Ping Ooi

Chan Kim Lee

Hongtao Xu

Chien-Nan Kuo

Chung Peng Jackson Kong

Hemasundar M Geddada

Chung Peng (Jackson) Kong

Hemasundar Mohan Geddada

'Hybrid' transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels.

Hybrid package transmission line circuits

Examples are disclosed for outphasing power combining by antenna. In some examples, a device such as a wireless device may route a first signal to a first branch of an outphasing power amplifier system and route a second signal to a second outphasing power amplifier system. The outputs of the first branch and the second branch may be directly coupled to an antenna. The antenna may be arranged to operate as a power combiner for signals outputted from the first and the second branches of the outphasing power amplifier system. A power combined signal may then be transmitted from the antenna. Other examples are described and claimed.

Outphasing power combining by antenna

A wireless device includes high-performance CMOS RF switches that include serially connected transistors coupled between an input terminal and an output terminal, with an inductor coupled from the input to the output that resonates out the capacitance of the transistors to improve isolation. The transistors have a floating/bootstrapped body with remote body contacts.

CMOS RF switch for high-performance radio systems

A dual reactive shunt feedback low noise amplifier design may include a transconductance amplifier having a capacitor coupled across it and a pair of coupled inductors coupled across it. In one embodiment, the coupled inductors may be laid out as two overlapping coils.

Dual reactive shunt low noise amplifier

This invention relates to a low noise amplifier, used in radio frequency integrated circuit design, especially low noise amplifiers for ultra broad-band wireless communication, comprising at least a transistor of the core circuit of a low noise amplifier structure, a transformer that is implemented on the chip, in order to form a dual feedback amplifier, that is, an amplifier structure comprising an inductive feedback and a capacitive feedback, wherein the capacitive feedback is used for the low and medium frequency range, while the inductive feedback is used for the high frequency range. By assembling an amplifier circuit with these two feedback paths, it is possible to provide a broadband and good impedance matching at the signal input end of the circuit. The low noise amplifier circuit structure of the present invention is able to provide optimal conditions for broadband input impedance matching and broadband noise optimum; besides significantly increasing the gain and gain flatness, there are also huge improvements to the noise performance and the cost-down on fabrication, and the energy consumption can also be maintained at a very low level.

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Portland, OR, United States of America

Chang-Tsung Fu