Samsung Electronics Co., Ltd.

Chang Sub Lee

Kyeong Ik Min

Hyung Jin Kim

Jong Ho Park

Sang Ho Yoon

Dong Yeoul Lee

Ji-heon Oh

Chang Mo Lee

Jung Kyung Kim

A media clock recovery device, a method for recovering media clock, and an electronic device are provided. The media clock recovery device comprising processing circuitry configured to determine whether a time stamp is normal, the time stamp being received in a packet through a network, calculate an average time interval of a dummy time stamp, the calculated average time interval of the dummy time stamp being used for generating a media clock in response to determining the time stamp is not normal, generate the dummy time stamp based on the calculated average time interval of the dummy time stamp, wherein the processing circuitry is configured to determine the time stamp is not normal, in response to the packet not being received within a time threshold value from a reception time of a previously received packet.

Media clock recovery device and a method for recovering media clock, and an electronic device

Provided is a condensing lens condensing a light from a light source, and a lighting device equipped with the condensing lens. The condensing lens may enable a light to be selectively incident upon a plurality of first incident portions based on an emission angle, may totally-reflect, using a second incident portion, the light refracted by the plurality of first incident portions, and may refract the totally-reflected light using a third incident portion.

Condensing lens and lighting device equipped with said condensing lens

A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes a circuit board comprising at least one device region, a plurality of electrode regions, at least one first thermal via exposed through upper and lower surfaces of the at least one device region, and a plurality of second thermal vias exposed through upper and lower surfaces of the plurality of electrode regions; at least one first thermal pad bonded to the upper surface of the at least one device region and connected to the first thermal via; at least one LED mounted on the at least one first thermal pad; a plurality of first electrode pads bonded to the upper surface of the electrode region and connected to the second thermal vias; and a plurality of wires to connect the at least one LED with the plurality of first electrode pads.

Light emitting device package and manufacturing method thereof

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Seoul, South Korea

Chang Sub Lee