Samsung Electro-Mechanics Co., Ltd.

Chang Su Park

Yeong Gyu Lee

Heung Woo Park

Sang Kyeong Yun

Jong Hyeong Song

Suk Kee Hong

Ohk Kun Lim

Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

Optical modulator module package using flip-chip mounting technology

A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.

Semiconductor package using flip-chip mounting technique

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Gyeonggi-do, South Korea

Chang Su Park