Hon Hai Precision Industry Co., Ltd.

Tsinghua University

Foxconn Technology Co., Ltd.

Hong-fu Jin Precision Industry (shenzhen) Co., Ltd.

Shenzhen Treasure City Technology Co., Ltd.

Chang-Shen Chang

Hsien-Sheng Pei

Yuan Yao

Juei-Khai Liu

Chao-Hao Wang

Kai-Li Jiang

Chang-Hong Liu

Ben-Fan Xia

Zhen-Yu Wang

Feng-Wei Dai

Hai-Zhou Guo

Yun-Hsin Kevin Liao

Shou-Shan Fan

A method for making a carbon nanotube composite preform includes following steps. A substrate is provided. Carbon nanotubes are formed on the substrate. The carbon nanotubes and the substrate are placed in a solvent for a predetermined time. The carbon nanotubes and the substrate are drawn from the solvent. The carbon nanotubes and the substrate are dried.

Method for making carbon nanotube composite preform

An electronic device includes a first housing with a first air inlet and outlet, a heat dissipation assembly, and a filter structure between the first housing and the heat dissipation assembly. The heat dissipation assembly defines a second air inlet and outlet. The first air inlet, the second air inlet, the second air outlet and the first air outlet communicate with each other. The heat dissipation assembly draws air across itself from the two air inlets, and expels the air from the two air outlets. The filter structure covers the second air inlet and defines a plurality of very small holes which function to filter dust out from the incoming air.

Electronic device

An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group.

An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage.

Electronic device with heat dissipation module

A carbon nanotube composite preform includes a substrate and a plurality of carbon nanotubes formed thereon. Each carbon nanotube includes a first end adjacent to the substrate and a second end away from the substrate. Gaps between the second ends of the carbon nanotubes are bigger than gaps between the first ends thereof. The method for making the carbon nanotube composite preform includes the following steps: (a) providing a substrate; (b) forming a plurality of carbon nanotubes (e.g., a carbon nanotube array) on the substrate; (c) placing the carbon nanotubes and the substrate in a solvent for some time; (d) removing the carbon nanotubes and the substrate from the solvent; (e) drying the carbon nanotubes and the substrate to form a carbon nanotube composite preform.

Carbon nanotube composite preform and method for making the same

A composite material includes a body and a plurality of nano-scale probes. The body is made of a polymer. The plurality of nano-scale probes is embedded in the body. The nano-scale probes are substantially uniformly distributed in the polymer matrix. The nano-scale probes are nanowires, nano-particles or nanotubes.

Composite material

An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.

Heat pipe with composite wick structure

A composite material includes a body and a plurality of nano-scale probes. The body is made of a polymer. The plurality of nano-scale probes is embedded in the body. The nano-scale probes are substantially uniformly distributed in the polymer matrix. A method for making the composite material is further provided.

Composite material and method for making the same

A method for fabricating a carbon nanotube yarn includes providing a plurality of carbon nanotube arrays; pulling out, by using a tool, a first carbon nanotube structure from one of the carbon nanotube arrays; pulling out a subsequent carbon nanotube structure from another one of the carbon nanotube arrays; joining a leading end of the subsequent carbon nanotube structure to a trailing portion of the carbon nanotube structure already formed by contacting the leading end of the subsequent carbon nanotube structure with the trailing portion of the already-formed carbon nanotube structure, with the contact occurring along a common lengthwise direction of the two carbon nanotube structures, thereby forming a lengthened carbon nanotube structure; repeating the pulling and the joining until the lengthened carbon nanotube structure has a desired length; and treating the lengthened carbon nanotube structure with an organic solvent.

Method for fabricating carbon nanotube yarn

A method for making a thermal interface material includes the steps of: (a) providing an array of carbon nanotubes formed on a substrate, the carbon nanotubes having interfaces defined therebetween; (b) providing a transferring device and disposing at least one low melting point metallic material above the array of carbon nanotubes, using the transferring device; and (c) heating the low melting point metallic material and the array of carbon nanotube to a certain temperature to make the at least one low melting point metallic material melt, then flow into the interspaces between the carbon nanotubes, and combine (e.g., mechanically) with the array of carbon nanotubes to acquire a carbon-nanotube-based thermal interface material.

Method for making thermal interface material

A heat pipe includes an elongated casing (), a wick (), at least one artery mesh (), and working medium filling in the casing. The casing has an evaporating section () and a condensing section (). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion () and a small portion () with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.

A heat spreader includes a bottom wall () and a cover () hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space () therebetween for receiving a working fluid therein. A wick structure () is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.

Heat spreader with vapor chamber defined therein

An LED lamp cooling apparatus () includes a substrate (), a plurality of LEDs () electrically connected with the substrate, a heat sink () for dissipation of heat generated by the LEDs and a pulsating heat pipe () thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions () and a plurality of heat radiating portions (), and contains a working fluid () therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.

LED lamp cooling apparatus with pulsating heat pipe

A light-emitting diode (LED) assembly includes a circuit board (), at least one LED () being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus () being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole () corresponding to a position of the at least one LED. Thermal interface material () is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.

Light-emitting diode assembly

A tower-type heat pipe () includes a metal plate (), a heat pipe with a container () and a wick (), and a cover (). The heat pipe is vertically mounted on the metal plate. A solder () is used to soldering an outer wall of the container with the metal plate and a top of the container with the cover. An air gap () is defined in the metal plate and located between the solder and the wick along a flowing path of the solder in order to prevent the solder from flowing into an inside of the container to contaminate the wick.

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Taipei Hsien, Taiwan

Chang-Shen Chang