Samsung Electronics Co., Ltd.

Dongjin Semichem Co., Ltd.

Chang-kun Kang

Jae-hyun Kim

Hye-kyoung Lee

Seung-keun Oh

Chi-hwan Lee

Myoung-chul Eum

Kyeong-il Oh

Seong-Chan Han

Chil-hoon Lee

Han-ju Kim

Young-rock Lee

A protective film composition includes a polymer having the following formula:  each of a, b, and c is a mole fraction; a+b+c=1; 0.05&#x2264;a/(a+b+c)&#x2264;0.3; 0.1&#x2264;b/(a+b+c)&#x2264;0.6; 0.1&#x2264;c/(a+b+c)&#x2264;0.6; each of R, R, and Ris a hydrogen atom or a methyl group; Ris a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and Ris a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

Protective film composition and method of manufacturing semiconductor package by using the same

A protective film composition includes a polymer having the following formula: 

A method of manufacturing a semiconductor package includes preparing a package substrate including a semiconductor chip mounting region. A semiconductor chip is mounted in the semiconductor chip mounting region. A dam surrounding the semiconductor chip is formed. The formation of the dam includes depositing a first solution having a temperature below a set first temperature. A region under the semiconductor chip and a region defined by the dam are filled with an underfill by depositing the first solution having a temperature equal to or higher than the set first temperature.

Method of manufacturing semiconductor package

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Seoul, South Korea

Chang-kun Kang