Samsung Electro-mechanics Co., Ltd.

Cheil Industries Inc.

Chang Jae Lee

Yong Tae Kim

Young Jun Kim

Jin Kyu Kim

Bok Nam Jang

Tae Ho Ko

Joong In Kim

Ji Heung Kim

Seok Jun Ahn

Jun Ho Kang

Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.

Copper clad laminate, printed circuit board, and method of manufacturing the same

Polyarylene ether is polymerized using a dissolving agent including anisole, wherein the polyarylene ether includes about 1 to about 3,000 ppm of anisole.

Polyarylene ether and method for preparing the same

Growing community of inventors

Suwon-si, South Korea

Chang Jae Lee