Samsung Electro-mechanics Co., Ltd.

Chang-Jae Lee

Jong-Guk Kim

Sung-Jun Park

Myung-Gun Chong

Dong-Chul Shin

Sim-Hwan Park

Tae-Wook Jung

Chul-Min Lee

Tae-Ho Ko

Seon-Hye Kim

Jun-Ho Kang

Joong-Mo Hwang

A manufacturing method for a printed circuit board includes: transferring roughness of a metal film to an insulating layer by laminating the metal film on the insulating layer, the metal film having the roughness formed on one surface thereof and having a discrete metal layer laminated thereon; exposing a surface of the insulating layer, on which the roughness is transferred, by removing the metal film; processing the surface of the insulating layer having the roughness formed thereon with an acidic solution; and forming a circuit pattern on the insulating layer by a plating process.

Manufacturing method for printed circuit board

A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer.

Flexible printed circuit board and manufacturing method thereof

Growing community of inventors

Suwon-si, South Korea

Chang-Jae Lee