Skhynix Inc.

Lg Electronics Inc.

Electronics and Telecommunications Research Institute

Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Coupang, Corporation

Hyundai Motor Company

Other

Osong Medical Innovation Foundation, Korea University Research and Business Foundation

Doosan Infracore Co., Ltd.

Korea Hydro Nuclear Power Co., Ltd.

Korea Advanced Institute of Science and Technology

Yonsei University

Korea Institute of Machinery & Materials

Korea University of Technology and Education Industry-University Cooperation Foundation

Chang Hyun Kim

Sung Joon Ahn

Young Kil Kim

Jae Jin Lee

Do Yun Lee

Sung Kwon Choi

Ki Young Lee

Seong Il Yang

Min Chang Kim

Oh Woog Kwon

Hun Sam Jung

Sang Kyu Park

Yoon Hyung Roh

Young Ae Seo

Eun Jin Park

Yun Su Jin

Jinxia Huang

Ying Shun Wu

Choung Ki Song

Hyun Jin Choi

Yong Mi Kim

Yo Sep Lee

Ki Hwan Choi

Young-Ae Seo

Changhao Yin

Dong Hwa Lee

Sung Jin Park

Won Tae Choi

Oh Jo Kwon

Lianxi Bai

Sang Ho Yim

Chang Geun Jin

Yoon-Hyung Roh

Hyeon Chang Baek

Jae Seung Lee

Eun Sub Shim

Kyung Rin Kim

Jin Yong Kang

Byoung Won Hwang

Ha Woong Jeong

Sung Tae Kim

Sang Ho Lee

Yong Woo Lee

Yang Je Lee

Hyung Sik Won

Seon Wook Kim

Eui Cheol Lim

Jae Woong Yun

Eung Soo Lee

Yu Kyoung Song

Kyung Jae Lee

Sang Won Lee

Sang Hee Ahn

Cheol Ryu

Sun Woong Kim

Seon Sook Hong

Jong Hun Shin

Kyeong Suk Jin

Seung Chul Pyo

Dong Seob Jang

Seo Kyoung Leem

Jae Heon Noh

Seung Hun Lee

Sun Choi

Jae Il Kim

Hyun Seok Kim

Jae-Hyun Kim

Kang Seol Lee

Jong Beom Ra

Soo Woong Lee

Dong Kyun Kim

Kyu Young Hwang

Chun Seok Jeong

Jae Eun Kim

Ki-Young Lee

Yun Keun Lee

Seung Wook Oh

Lee Hyoung Cho

Yoon Sok Park

Tae Jung Kim

Jung Yup Kim

Jaeil Kim

Byung Kuk Yoon

Bok Soon Kwon

Bongkyun Jang

Jun Kyung Na

Hyo Rang Kang

Jung Woo Sung

Eung Chul Park

Jong Il Kim

Seok Bo Shim

Kyung Ju Lee

Byung-Ik Choi

Soo Bin Lim

Kwangseop Kim

Sang Min Kim

Yun Hwangbo

Doo Bock Lee

Kyeong Keun Kim

Young Ook Song

A semiconductor device includes a command decoder configured to generate a block command, based on a command address, and a clock division circuit configured to divide an internal clock and an inverted internal clock to generate division clocks. In the present disclosure, the clock division circuit is configured to stop generating the division clocks for a block section when the block command is generated.

Semiconductor devices for calibrating phase of division clock

A Processing-In-Memory (PIM) computing system and a PIM computation offloading method thereof perform PIM computation offloading using a DMA engine. The DMA engine is configured to process a transaction by respectively performing descriptor requests and PIM requests for one or more descriptors stored in a memory, in response to a memory request of a CPU. The memory includes a PIM unit and a memory array, which memory array may be a DRAM. In response to the PIM requests, the PIM unit performs PIM operations using information included in data provided to the DMA engine in response to the descriptor requests.

PIM computing system and PIM computation offloading method thereof

A semiconductor memory device may include a plurality of memory cells wherein identifiers may be provided to the memory cells. The semiconductor memory device may include a first circuit, a second circuit and a power control circuit. The first circuit may include a first power terminal and a second power terminal. The second circuit may include a third terminal and a fourth terminal. The power control circuit may be configured to apply a first power voltage or a ground voltage to the first power terminal and to apply the ground voltage to the second power terminal based on the identifiers.

Semiconductor memory device, processing system including the same and power control circuit for the same

A Processing-in-Memory (PIM) computing system and a memory controller provide improved memory traffic efficiency and improved PIM operation efficiency by increasing a burst length of a PIM operation relative to a general memory request. In embodiments, the increased burst length allows the PIM operation to be performed in units of pages, wherein a page is management unit of a memory used in the PIM operation.

PIM computing system and memory controller thereof

Provided is an electronic apparatus and a method thereof. The method includes identifying pickup item information, identifying at least one storage place corresponding to the pickup item information among a plurality of storage places in the item storage center based on information on or regarding an item group located at each of the plurality of storage places, and providing information on the identified storage place and the pickup item information to a manager terminal, wherein the item group comprises at least one same item corresponding to an item group, and at least a portion of a plurality of item groups comprising a same item are stored in different storage places in the item storage center.

Electronic apparatus for providing picking information of item and method thereof

A semiconductor device may include: a first receiver configured to receive a chip select signal from a receiving node to which a termination resistor is coupled and configured to generate a first internal chip select signal; a command pulse generation circuit configured to generate a command pulse for entering into a self-refresh operation based on an internal command address and the first internal chip select signal; and an operation control circuit configured to, when the semiconductor device enters the self-refresh operation based on the command pulse, generate a resistor value change signal that adjusts the value of the termination resistor.

Semiconductor device

The method for estimating mental health and providing solution for mental health by learning psychological data and biological data based on machine learning includes: (a) acquiring, by mental health estimating device, psychological data for testing and biological data for testing of test subject from terminal of the test subject in state in which first estimated model is learned by referring to estimated mental health data for learning output from the first estimated model and ground truth mental health data corresponding to the estimated mental health data after psychological data for learning and biological data for learning of learning subjects are input to the first estimated model; and (b) inputting, by the mental health estimating device, the psychological data for testing and the biological data for testing to the first estimated model to allow the first estimated model to output estimated mental health data for testing.

Method for estimating mental health and providing solution for mental health by learning psychological data and physical data based on machine learning and mental health estimating device using the same

A method of manufacturing a flip chip package includes forming a plurality of semiconductor chips and bonding the semiconductor chips to a package substrate. The method further includes electrically testing the plurality of semiconductor chips on the package substrate, molding the tested semiconductor chips, and singulating the molded chips. Electrically testing the semiconductor chips includes covering the semiconductor chips with a protection member.

Method of manufacturing a molded flip chip package to facilitate electrical testing

The systems and methods for receiving a user input for a combination of a plurality of object pointers, wherein the object pointers are associated with a corresponding plurality of items located within a first area; retrieving one or more system parameters comprising a current location and a current container; transmitting a request for the combination of the plurality of object pointers, the request comprising the one or more system parameters; receiving the combination of the plurality of object pointers in response to the request; displaying locations of the plurality of items relative to the current location; and processing the plurality of items until a threshold capacity of the current container is reached by receiving input data corresponding to the plurality of object pointers.

Systems and methods for on-demand decomposition of orders and urgency-based identification of item combination for fulfillment

A device includes a section signal generation circuit configured to generate a section signal including bits activated during an operation section of each of internal operations included in a mode operation, and a mode command generation circuit configured to generate a mode command for performing the internal operations included in the mode operation from an oscillating signal, based on the section signal.

Devices for generating mode commands

A memory system is disclosed, which relates to technology for implementing data communication between memory devices. The memory system includes a plurality of memory devices and a memory controller. The memory devices allow a data packet composed of data and header information to be directly communicated between the memory devices. The memory controller transmits the data packet to a source memory device from among the plurality of memory devices, and receives the data packet from a last memory device from among the plurality of memory devices. Each of the memory devices hashes the header information such that the data is accessed, using a result of the hash, in address regions located at different positions.

Memory system

In accordance with an embodiment of the present disclosure, an image synchronization device includes a light emitting source configured to emit light at intervals of a predetermined time, a sampling phase calibration circuit configured to calibrate a sampling phase of each of the first image sensor and the second image sensor on the basis of a light emitting timing of the light emitting source and a delay calibration circuit configured to generate delay information on the basis of a result of comparison between first image information transmitted from the first image sensor and second image information transmitted from the second image sensor.

Image synchronization device and image information generation apparatus including the same

A semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip and electrically connected to the first semiconductor chip by a first through electrode and a second through electrode. The first semiconductor chip may electrically connect the first through electrode to a third test resistor during a second test operation. The first semiconductor chip may detect a voltage level of the first internal node, which is determined by resistance values of the third test resistor and the first and second through electrodes, to test a short failure between the first and second through electrodes during the second test operation.

Semiconductor devices including through electrodes

An exemplary embodiment of the present invention provides a method of transferring a micro device. The method of transferring the micro device includes: separating a transferring film from a micro device transferred to a target substrate and bending the transferring film upwardly to form a bent circular arc, and pressurizing an upper transferring film fed after the bent circular arc is formed by a pressurizing roller rotating at an upper side of the target substrate.

Method and apparatus for transferring micro device, and electronic product using the same

Growing community of inventors

Seoul, South Korea

Chang Hyun Kim