Samsung Electronics Co., Ltd.

Chang-Hyeon Nam

Seung-Kun Lee

Duk-Min Ahn

Joong-Sup Choi

Chang-Moon Ahn

Wi-Seob Kang

Kyung-Hyun Kim

Hong-Seong Son

Sang-Oh Park

Young-Min Kwon

Yoon-Kyung Kim

Man-Young Lee

Young-Kwang Myoung

Seung-Kim Lee

Han-Yong Chae

A substrate dryer includes, among other things, means for generating isopropyl alcohol bubbles, and a vibrator to atomize stored isopropyl alcohol. A heater may be provided to heat pumped isopropyl alcohol, as wells as a spray nozzle to spray the heated IPA to the vibrator. It is possible to increase the concentration of the isopropyl alcohol supplied for the purpose of drying the substrate. Improved substrate drying is achieved.

Substrate dryer and a drying method

A semiconductor device having a trench in the side portion of a conducting line pattern and methods of forming the same. The semiconductor device provides a way of preventing an electrical short between the conducting line pattern and a landing pad adjacent to the conducting line pattern. There are disposed two conducting line patterns on a semiconductor substrate. Each of the conducting line patterns includes a conducting line and a conducting line capping layer pattern stacked thereon. Each of the conducting line patterns has a trench between the conducting line capping layer pattern and the conducting line. Conducting line spacers are formed between the conducting line patterns. One conducting line spacer covers a portion of a sidewall of one of the conducting line patterns, and the remaining conducting line spacer covers an entire sidewall of the remaining conducting line pattern. A landing pad is disposed between the conducting line patterns.

Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the same

An apparatus for cleaning semiconductor wafers includes a chamber, a bubbler having a vapor generating part for generating alcohol vapor and a spray pipe for spraying the alcohol vapor into the chamber, a gas supply nozzle for spraying gas into the chamber to dry the wafers, a liquid supply nozzle for supplying cleaning liquid into the chamber and a discharge system. The spray pipe of the bubbler has a liquid retention portion that keeps condensate of the alcohol vapor from issuing into the chamber. The gas supply nozzle has a spray outlet configured to spray the same amount of the drying gas onto all of the wafers in the chamber. The liquid supply nozzle has liquid supply openings only in a side portion thereof so that liquid alcohol will not become trapped therein.

Apparatus for cleaning semiconductor wafers

An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a shielding surface of the semiconductor substrate. The shielding cover is movable in an upward and downward direction. The apparatus also includes a device for cleaning the edge of the semiconductor substrate. According to the apparatus, after a wafer edge is etched, foreign substances remaining at the wafer edge is efficiently removed.

Apparatus and method for treating edge of substrate

A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section. The cleaning apparatus may effectively remove impurities from the edge, side and bottom sections of the semiconductor substrate.

Cleaning method and cleaning apparatus for performing the same

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Gyeonggi-do, South Korea

Chang-Hyeon Nam