Samsung Electronics Co., Ltd.

Hyosung Corporation

Seagate Technology International

Chang-Hwan Lee

Je-An Yu

Tae Young Kim

Jin-Woo Kim

Chang-Won Choi

Chul Ho Jung

Sang-Jib Han

Hae Jung Lee

Min-Seok Han

Hae Ryong Lee

Young-Shin Kim

Moon-Seok Choi

A protective cover for an electronic device is provided. The electronic device includes a protective cover configured to protect at least a partial region of the electronic device. The protective cover is detachably connectable with the electronic device by a snap-fit structure provided on at least one portion in surface contact with the electronic device.

Protective cover and electronic device having the same

A hard disk drive effectively removes internal humidity therefrom and thus improves the reliance and performance of the hard disk drive in high and increased humidity environments.

Hard disk drive having desiccant member

A method of controlling a flying height of a magnetic head of a hard disk drive includes calculating a corrected flying on demand (FOD) voltage to correct a difference between a measured flying height measured by applying a burn-in FOD voltage corresponding to a target flying height and a burn-in flying height in a reference FOD voltage profile corresponding to the burn-in FOD voltage, using the reference FOD voltage profile, in the reference FOD voltage profile that is a profile of a second signal for calculating the flying height of the magnetic head with respect to a first signal for calculating an FOD voltage that allows an end of the magnetic head to thermally expand and protrude when applied to a heater included in the magnetic head, and applying an applied FOD voltage obtained by applying the corrected FOD voltage, to the burn-in FOD voltage, to control the flying height of the magnetic head. Thus, the reliability in the read/write operation can be improved and performance of the hard disk drive can be improved.

Hard disk drive, method of controlling flying height of magnetic head thereof, and recording medium containing computer program thereon

A method of controlling a flying height of a magnetic head of a hard disk drive apparatus includes producing a reference FOD (flying on demand) voltage profile defining a relationship between the flying height of the magnetic head and an FOD voltage at a measured temperature, wherein an end of the magnetic head thermally expands and protrudes when the FOD voltage is applied to a heater included in the magnetic head and setting the reference FOD voltage profile that is corrected using a reference maximum flying height of the magnetic head that is preset at room temperature, as an applied FOD voltage profile to control the flying height of the magnetic head.

Hard disk drive apparatus, method to control flying height of magnetic head thereof, and recording media for computer program therefor

A high strength polyamide fiber consisting of polyamide monofilaments each having a fineness of less than 4 denier and a stress-strain curve where (a) the monofilament elongates less than 5% when subjected to an initial stress of 1.0 g/d, (b) it elongates less than 12% when subjected to a middle stress of 4.5 g/d, and (c) it elongates more than 3% over a tensile strength range from a tensile strength of at least 9.0 d/g to the tensile strength at break of the monofilament, the elongation values being measured at ambient temperature.

Polyamide fiber for uncoated airbags

The present invention relates to a low shrinkage polyamide fiber suitable for use as a yam of a fabric for airbags and an uncoated fabric for airbags produced using the same. The fabric produced using the low shrinkage polyamide fiber of the present invention has high tensile strength and tear strength, and excellent quality, and thus, is useful as a fabric for airbags.

Method for producing low shrinkage polyamide fiber and uncoated fabric for airbags made of the same

In an embodiment, a memory module includes a first group of multi chip packages, including one or more non-volatile memories, and a second group of multi chip packages, including one or more volatile memories, wherein the first and second groups of multi chip packages are electrically connected to a substrate. Various types of memory packages can be integrated into a single module that is mounted to the substrate, such as a printed circuit board, for improved size efficiency.

Memory module with different types of multi chip packages

Integrated circuit devices are provided including first and second chips and a common input/output pad electrically coupled to the first and second chips. At least one of the first and second chips includes a high voltage generator configured to receive an input voltage through the common input/output pad and generate a test voltage responsive to a test mode signal during a test mode of operation. The test voltage is higher than the input voltage. Related methods of operating integrated circuit devices and semiconductor devices are also provided.

Multi-chip semiconductor packages and methods of operating the same

Disclosed is an improved method for fabricating a DRAM cell capacitor which can prevent over-etching of polysilicon storage node. The method includes the steps of etching a first insulating layer on a semiconductor substrate to form a storage contact hole, filling the storage contact hole with a first conductive material to form a storage contact plug, forming a second insulating layer over the first insulating layer including the storage contact plug, forming a mask over the second insulating layer to define a storage node region, using the mask and etching the second and first insulating layers to form an opening therein to an upper surface of the storage contact plug, and filling the opening with a second conductive material to form a storage node.

Growing community of inventors

Seoul, South Korea

Chang-Hwan Lee