Hong Kong Applied Science and Technology Research Institute Company, Limited

Chang Hwa Chung

Xunqing Shi

Ziyang Gao

Bin Xie

Wei Ma

Man-Lung Sham

Jyh-Rong Lin

Chi Kuen Vincent Leung

Tung Ching Lui

Peng Sun

Man Lung Ivan Sham

Yeung Yeung

Kwan Wai Raymond To

Lap-Wai Lydia Leung

Xunqing Shu

Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in flash memory devices. In an example embodiment, a semiconductor chip may comprise a through-silicon via and a sidewall pad.

Semiconductor chip with through-silicon-via and sidewall pad

There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs.

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

There is described a bonding method for through-silicon-via bonding of a wafer stack in which the wafers are formed with through-silicon-vias and lateral microchannels that are filled with solder. To fill the vias and channels the wafer stack is placed in a soldering chamber and molten solder is drawn through the vias and channels by vacuum. The wafers are held together by layers of adhesive during the assembly of the wafer stack. Means are provided for local reheating of the solder after it has cooled to soften the solder to enable it to be removed from the soldering chamber.

Bonding method for through-silicon-via based 3D wafer stacking

Subject matter disclosed herein may relate to energy harvesting piezoelectric modules as may be used, for example, in power supplies for tire pressure monitoring systems.

Piezoelectric module for energy harvesting, such as in a tire pressure monitoring system

An apparatus and method for generating electricity using piezoelectric material. The apparatus comprises a first elongate member and a second elongate member that are joining together at first and second points which are spaced apart from each other. The second elongate member comprises a piezoelectric element, or has a piezoelectric element mounted thereon. When pressure is applied to the first elongate member, the second elongate member is stretched and the stretching force is applied to the piezoelectric element. This generates electricity. A similar arrangement with a third elongate member may be provided on the other side of the second elongate member. The apparatus may be placed in a shoe or underneath a floor, so that the variation in pressure caused by walking may be used in generate electricity.

Apparatus and method for generating electricity using piezoelectric material

The subject matter disclosed herein relates to methods to reduce warpage of a substrate.

Substrate warpage-reducing structure

A method of determining the location information of a plurality of wheels mounted on a vehicle by obtaining a relationship between the lateral location of a wheel and the polarity of a transverse acceleration transmitted by an accelerometer of a wheel in response to a lateral turn of the vehicle in a direction of a lateral side of the vehicle and determining the lateral location of a wheel with reference to the polarity of the transverse acceleration signal transmitted by the accelerometer of the wheel upon the vehicle undergoing a lateral turn.

Method and apparatus for identification of wheels of a vehicle and a vehicle comprising same

There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bonding is used to electrically connect the vias. The adhesive layers are patterned to enable outgassing and to provide stress relief.

Growing community of inventors

Hong Kong, China

Chang Hwa Chung