Samsung Electronics Co., Ltd.

Chang-hun Lee

Jong-hyon Ahn

Joon-Hoo Choi

Jung-Uk Shim

Ki-Seok Cha

A semiconductor device has a stress reducing laminate. Grooves are formed on the surface of a material layer selected from a multilayer structure of the semiconductor device, for example, a conductive layer. The cross sections of the grooves are semicircular or semi-elliptic. The stress applied to the conductive layer having the grooves is divided into a vertical component and a horizontal component with respect to the surface of the conductive layer. Accordingly, the stress applied vertically to the conductive layer is reduced, making it is possible to prevent the conductive layer from cracking due to stress and to reduce the stress transmitted to material layers under the conductive layer.

Semiconductor device having stress reducing laminate and method for manufacturing the same

A liquid crystal displays and a method of production in which a plurality of data lines are formed on an insulating substrate with a plurality of gate lines formed on the insulating substrate and arranged perpendicular to the data lines and are located at opposite sides with respect to the data lines. The first and the second common electrode lines are arranged parallel to the gate lines and divided into a plurality of bars which are located at opposite sides with respect to the data lines. A plurality of common electrodes are formed parallel to the data lines and connected to the first and the second common electrode lines. An insulating film covers the gate lines, the data lines, the first and second common electrode lines and the common electrodes. A secondary common electrode is formed on the insulating film and arranged parallel to the data lines. Moreover, the secondary common electrode overlaps edges of the data line to play a role as an electric field blocking webbing and contacts the common electrode lines located at opposite sides with respect to the data line through contact holes. A contact pattern is formed on the insulating film and connects the two gate lines located at opposite sides with respect to the data line through contact holes.

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Kyungki-do, South Korea

Chang-hun Lee