Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Chang Hun Kim

Ji Hyun Kim

Byong Jin Kim

Jae Ung Lee

Yung Woo Lee

Dong Hyun Bang

EunNaRa Cho

Wook Choi

Ho Jeong Lim

Min Chul Shin

KooWoong Jeong

Seung Mo Kim

Se Man Oh

Jung Hwa Kim

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Semiconductor package and manufacturing method thereof

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a substrate comprising a dielectric layer and a wiring pattern embedded in and exposed from the dielectric layer.

Finger print sensor and manufacturing method thereof

Growing community of inventors

Seoul, South Korea

Chang Hun Kim