Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Chang Hoon Kwak

Il Woo Park

Chul Soo Yoon

Jong Rak Sohn

Il Han Park

Joon Ho Yoon

Yun Seup Chung

Na Na Park

Seong Ik Hong

Kyu Jin Lee

Cheol Jun Yoo

Seong Ah Joo

Chulsoo Yoon

Jin Hwan Kim

Hyo Jin Lee

Min Jung Kim

Hak Hwan Kim

Sung Jin Ahn

Kyung Il Seo

Jeong Hee Kim

Young Mok Lee

Ii Woo Park

Na-Na Park

Jin Kweon Chung

A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.

Semiconductor light emitting element package including solder bump

There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package and LED package manufactured thereby

A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

Light emitting device surrounded by reflection wall and covered with fluorescent film

There is provided a white light emitting device including: a blue LED emitting blue light; a red phosphor excited by the blue light, emitting red light, and including a nitrogen (N)-containing compound; a yellow phosphor excited by the blue light and emitting yellow light; a first green phosphor excited by the blue light, emitting first green light having a first full width half maximum, and including a nitrogen (N)-containing compound; and a second green phosphor excited by the blue light and emitting second green light having a second full width half maximum larger than the first full width half maximum of the first green phosphor.

White light emitting device, display apparatus and illumination apparatus

Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package, and LED package manufactured thereby

The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

Light emitting diode package and manufacturing method thereof

Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

White light emitting diode with yellow, green and red light emitting phosphors

A white light emitting device including: a blue light emitting diode (LED); a green silicate phosphor formed on the blue LED; and a red sulfide phosphor with a surface coated with a silicone oxide layer, the red sulfide phosphor formed on the blue LED.

White light emitting device

The invention provides a high quality composite phosphor powder which ensures diversity in emission spectrum, color reproduction index, color temperature and color, a light emitting device using the same and a method for manufacturing the composite phosphor powder. The composite phosphor powder comprises composite particles. Each of the composite particles includes at least two types of phosphor particles and a light transmitting binder. The phosphor particles have different emission spectrums. In addition, the light transmitting binder is formed between the phosphor particles and binds them together.

Composite phosphor powder, light emitting device using the same and method for manufacturing composite phoshpor powder

White light emitting diode with yellow, green and red light emitting phosphor

The present invention relates to phosphor blend for wavelength conversion and a white light emitting device using the same. The phosphor blend of the invention comprises three phosphors, A(PO)Cl:Eu, DSiO:Eu and MS:Eu at a composition where near ultraviolet radiation is converted into light positioned at a CIE coordinate (x, y), where 0.25&#x2266;x&#x2266;0.45 and 0.25&#x2266;y&#x2266;0.43, wherein A comprises at least one of Sr, Ca, Ba, and Mg, D comprises at least one of Ba, Sr, and Ca, and M comprises at least one of Sr and Ca. Furthermore, the present invention provides a new white light emitting device in combination of the phosphor blend and a near ultraviolet LED.

Phosphor blend for wavelength conversion and white light emitting device using the same

Composite phosphor powder, light emitting device using the same and method for manufacturing composite phosphor powder

White light emitting diode

Growing community of inventors

Seoul, South Korea

Chang Hoon Kwak