Samsung Electronics Co., Ltd.

Nae Wae Semiconductor Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Chang-hoon Jung

Su-ho Shin

Dong-Woo Lee

Tae-gyu Kim

Dong-jin Seol

Hwan-hee Kim

Tae-hoon Kim

Hwan-guem Kim

Jin-Sung Lee

Jae-woo Chung

Young-Gu Jin

Sung-gyu Kang

Seung-mo Lim

Tae-sang Park

You-seop Lee

Kwang-Hee Kim

Hyuk-soon Choi

Sang-kwon Wee

Bang-Weon Lee

Jong-kill Lim

Byong-ho Cheong

Dong-Jin Seol

Su-Ho Shin

Tae-Gyu c/o Samsung Electronics Co Ltd Kim

Hwan-Hee Kim

Seung-Mo Lim

A fusing device includes a rotatable pressing roller, a fusing belt to rotate by a rotational force transmitted from the rotatable pressing roller, a nip forming member to contact an inner surface of the fusing belt to form a nip on a contact area between the rotatable pressing roller and the fusing belt, a heating member formed in approximately an internal central portion of the fusing belt to heat the nip forming member and the fusing belt, an inner support member formed within the fusing belt to press a nip part of the nip forming member toward the rotatable pressing roller, and an outer support member formed outside the fusing belt, and both ends of the outer support member being engaged with the inner support member to thereby reinforce the strength of the inner support member and form a path for radiation heat to disperse. The support unit includes an inner support member placed within the belt unit, and an outer support member placed outside the belt unit, both ends of the outer support member being engaged with the inner support member to reinforce the strength of the inner support member and to form a path for a radiation heat to disperse.

Fusing device and image forming apparatus having the same

A fixing device includes a fixing roller, a fixing belt which is made to rotate by a rotation force received from the fixing roller, a nip forming unit to form a nip zone at a contact area between the fixing roller and the fixing belt, and a first heating unit, which is separated from the nip zone, to apply heat to the fixing belt. The nip zone and the heating unit are separated, so that the heating unit can be prevented from being broken as a result of the pressurization and thermal deformation.

Fixing device and image forming apparatus having the same

A fusing device includes a pressure unit, a belt unit to rotate in outer contact with the pressure unit, a nip forming unit to form a nip over a contact portion between the pressure unit and the belt unit, a heating unit to heat the nip forming unit and the belt unit, and a support unit to press and support the nip forming unit constantly and having a plurality of heat transmission portions defined in a parallelogrammic shape of an oblique direction with respect to a traveling direction of the belt unit.

A fixing device includes a pressing roller, a fixing belt to receive a rotation force transferred from the pressing roller and to rotate thereby, a nip forming member which is mounted inside the fixing belt, the nip forming member including a heat transmission unit formed thereon, and a heat source, which is mounted inside the nip forming member, to simultaneously apply heat to the nip forming member and to the fixing belt through the heat transmission unit.

A micro lens array and method of fabricating the micro lens array. The micro lens array includes: a substrate; a plurality of holes penetrating the substrate; and a plurality of lens units on a first surface of the substrate, each lens being at a respective one of the plurality of holes. When the micro lens array is applied to a display device, a high contrast ratio can be obtained, and the light can be transmitted in a single direction.

Micro lens array and method of manufacturing the same

A piezoelectric inkjet printhead, and a method of manufacturing the same, includes an ink inlet for allowing inflow of ink, a plurality of pressure chambers to contain ink to be ejected, the plurality of pressure chambers being in communication with the ink inlet, a manifold formed in communication with the ink inlet, a plurality of restrictors connecting the manifold to respective first ends of the pressure chambers, a plurality of dampers at positions corresponding to respective second ends of the pressure chambers, the second ends being opposite the first ends, a plurality of nozzles in communication with the plurality of dampers for ejecting the ink, a plurality of actuators for applying a driving force to each of the pressure chambers for ejecting the ink, a damping membrane under the manifold for dampening a pressure change inside the manifold and a cavity under the damping membrane.

Piezoelectric inkjet printhead and method of manufacturing the same

A piezoelectric inkjet printhead capable of reducing a crosstalk and a method of manufacturing the same are provided. The inkjet printhead includes an upper substrate, an intermediate substrate, and a lower substrate that are sequentially stacked, wherein the upper substrate includes piezoelectric actuators on an upper surface of the upper substrate and pressure chambers and first restrictors on a lower surface of the upper substrate, the first restrictors extending from the pressure chambers and having a width smaller than a width of the pressure chambers, the intermediate substrate includes dampers passing therethrough, the dampers corresponding to the pressure chambers and second restrictors extending between the first restrictors and a manifold formed from a lower surface of the intermediate substrate and the lower substrate includes nozzles passing therethrough, the nozzles corresponding to the dampers.

A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.

Semiconductor wafer baking apparatus

Car alarm remote controller

Growing community of inventors

Seoul, South Korea

Chang-hoon Jung