Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Chang Ho Shin

Hun Joo Hahm

Jae Ho Shin

Dae Yeon Kim

Young June Jeong

Sung Oh Ahn

Hyung Suk Kim

Seok Chan Hong

Dong Hyun Cho

Chul Hee Yoo

Jung Park

Won Joon Lee

Dong Soo Lee

Sun Chul Kim

In Je Sung

Seog Ho Lim

Jae Jun Bang

Myoung Sun Ha

Jin Se Kim

A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.

Method of fabricating light emitting diode module

A light emitting module includes a circuit board having a plurality of reflective portions arranged in one direction and connection portions connecting the plurality of reflective portions, light emitting devices mounted on the plurality of reflective portions, and lens units disposed to cover the light emitting devices within boundaries of surfaces, of the plurality of reflective portions, on which the light emitting devices are mounted. A width of each of the connection portions in the other direction, perpendicular to the one direction thereof, is smaller than a diameter of each of the lens units, thus reducing a generation of a dark portion.

Light emitting module and lighting device using the same

Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.

Backlight unit

A light source module includes: a substrate; and a plurality of light emitting devices having different ranks and arranged on the substrate in columns and rows, the plurality of light emitting devices being classified in the different ranks based on at least one of color coordinates, brightness of light emitted therefrom and a driving voltage, wherein in at least one of the columns and rows, light emitting devices having different ranks from among the plurality of light emitting devices are alternated in a basic arrangement and are alternated in an inverse arrangement opposite to the basic arrangement.

Light source module and backlight unit

The present application provides an electronic apparatus including a substrate including a first electrode pad, a second electrode pad and an intermediate pad each disposed on one surface of the substrate and separated from one another. An electronic device is disposed on the substrate and including a first electrode unit and a second electrode unit. The first electrode unit has an adhesion surface facing the first electrode pad and the intermediate pad. The second electrode unit has an adhesion surface facing the second electrode pad.

Electronic apparatus

There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.

Surface light source using white light emitting diodes and liquid crystal display backlight unit having the same

An LED backlight unit has a substrate, a plurality of light emitting diodes disposed on the substrate, and a light guide plate is placed adjacent to the light source. A chassis fixes the light source and the light guide plate therein. Fixing means engagingly fit a side of the light guide plate into the light source plate and chassis with the substrate of the light source is fixed in surface contact with the chassis. The light guide plate is assemblable without a thermosetting adhesive.

LED backlight unit including light guide plate with fixing means

There are provided a printed circuit board connector for a backlight unit and a chassis using the same. The printed circuit board connector for a backlight unit including: a horizontal supporter; a vertical supporter having one end connected to the horizontal supporter to divide the horizontal supporter into first and second areas; at least one connecting terminal formed on the horizontal supporter to be partially exposed in each of the first and second areas of the horizontal supporter, wherein the connecting terminal electrically connects printed circuit boards having one ends placed on the first and second areas, respectively.

Growing community of inventors

Incheon, South Korea

Chang Ho Shin