Advanced Optoelectronic Technology, Inc.

Innolux Corporation

Asphetek Solution Inc.

Asphetek Solution (chengdu) Ltd.

Chang-Ho Chen

Tsau-Hua Hsieh

Po-Min Tu

Shih-Cheng Huang

Tzu-Chien Hung

Chien-Shiang Huang

Chien-Chung Peng

Chung-Wu Liu

Shiue-Lung Chen

Ying-Hung Tsai

I-ming Cheng

Chien-Cheng Kuo

Jong-Jan Lee

Paul-John Schuele

A lens assembly and Augmented Reality (AR) glasses, including a waveguide substrate, a wiring layer, a protective layer, an eye tracking component, and a lens. The waveguide substrate includes a first surface. The wiring layer is disposed on the first surface. The protective layer is disposed on the first surface and covering the wiring layer. The eye tracking component is disposed in the protective layer and is electrically connected with the wiring layer for tracking position of an eyeball. The lens is connected to a side of the protective layer away from the waveguide substrate. The AR glasses includes a display device and two lens assemblies. The display device is positioned between the two lens assemblies for emitting image light to the waveguide substrates of the two lens assemblies.

Lens assembly and augmented reality glasses

A flip chip light emitting diode includes a semiconductor layer comprising an epitaxial layer an N-semiconductor layer, a light active layer and a P-semiconductor layer arranged from top to bottom in series. A first electrode mounted on the semiconductor layer. A second electrode mounted on the semiconductor layer. A insulating layer mounted on the semiconductor layer. The N-semiconductor layer protrudes away from the epitaxial layer to form a protruding portion. The light active layer and the P-semiconductor layer mounts on the protruding portion in series. The insulating layer mounts between the first electrode and the protruding portion, the light active layer, the P-semiconductor layer and the second electrode. The flip chip light emitting diode also comprises a supporting portion, the supporting portion is mounted on a top surface of the epitaxial layer by a connecting portion. The connecting portion has same or different materials with the supporting portion.

Flip chip light emitting diode and method of manufacturing the same

Growing community of inventors

Hsinchu, Taiwan

Chang-Ho Chen