Samsung Electro-mechanics Co., Ltd.

Wits Co., Ltd.

Amotech Co., Ltd.

Chang Hak Choi

Jung Min Kim

Bon Seok Koo

San Kyeong

Hae Sol Kang

Jae Seok Yi

Byung Woo Kang

Byung Kun Kim

Byeong Cheol Moon

Seok Hyun Yoon

Jun Hyeon Kim

Byung Chul Jang

Dong Hun Kim

Moon Soo Park

Jung Young Cho

Kum Jin Park

Il Ro Lee

Jae Hun Choe

Jin Woo Kim

Sung Nam Cho

Tae Jun Choi

Jong Suk Jeong

Chan Hee Nam

Kyung Ryul Lee

Hyung Joon Jeon

Jong Hoon Yoo

Seung Hee Oh

Kang Heon Hur

Sung Yong An

Ki Yong Lee

Jae Yeong Kim

Yoon Hee Lee

Han Wool Ryu

Tai Yon Cho

Sang Kyun Kwon

Min Gi Sin

Song Je Jeon

Chi Hwa Lee

Kyung Lock Kim

Jong Myeong Jeon

Jin Su Park

Seung Ho Lee

Doo Young Kim

Sang Jong Lee

Dong Jin Kim

Jeong Ki Ryoo

Sang Hoon Kwon

Chang Ryul Jung

Ji Hye Han

Jong Sik Yoon

Doo Ho Park

Min Jung Cho

Byung Kyu Kim

Yu Hong Oh

Ki Myoung Yun

Yeon Tae Kim

Jung Deok Park

Soung Jin Kim

Sahn Nahm

Kwang Hee Nam

Kun Ho Koo

Young Soo Yi

Jun Hwan Jeong

Sang Min Youn

Ho Yeol Lee

Hwack Joo Lee

Jae Hyuk Jang

Tae Hoon Kim

Jong Han Kim

Chang Ho Lee

Ju Hwan Yang

Yeon Ho Kim

Dae Hee Lee

Seung Mo Lim

Byung Soo Kang

Su Bong Jang

Hee Soo Yoon

Chang Hoon Kim

Kyu Bum Han

Young Il Lee

Sung Hyung Kang

Yong Hui Li

Seung Hun Han

Chul Seung Lee

Jeong Gu Yeo

Sung Min Cho

Dong Joon Oh

Soon Kwang Kwon

Seong Hee Choi

Ic Seob Kim

Woong Do Jung

Hong Seok Kim

Sang Hyuk Kim

Min Han Kim

Sang Yeop Kim

Ji Hun Lee

Chul Min Sim

Seong Jae Lee

Jong Tae Yoo

Seung Min Kang

A multilayer electronic component includes a body including a dielectric layer including Ba and Ti and an internal electrode alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a side margin portion disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, wherein the side margin portion includes Sn and a transition metal, and wherein, in the side margin portion, a mole ratio of transition metal to Sn is 10 or more.

Multilayer electronic component

A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, and an external electrode disposed on the body and connected to the internal electrodes. The body includes an active portion including the plurality of internal electrodes to form capacitance, and cover portions disposed on the active portion, and the cover portions include an outer cover portion including a carbon compound and an inner cover portion disposed between the active portion and the outer cover portion. An average carbon content (Cc2) of the outer cover portion compared to an average carbon content (Cc1) of the inner cover portion satisfies 100≤Cc2/Cc1≤10,000.

A conductive paste includes: conductive powder containing Cu particles; and a glass frit including an oxide containing alkali metal, wherein a content of the alkali metal is 0.16 wt % or more and 0.35 wt % or less with respect to a total content of the Cu particles.

Conductive paste and multilayer electronic component

A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.

Multilayer ceramic capacitor and board having the same

A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Ceramic electronic component

A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Multilayer electronic component including non-conductive resin layer on body thereof

A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (BaCa)(Ti(Zr, Hf))O(where, 0≤x≤1, 0≤y≤0.5), and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode connected to the second internal electrode, wherein at least one of the dielectric layer and the internal electrode includes Sn or Dy. If Sn, an average content of Sn at an interface between the dielectric layer and the internal electrode is within a range of 5 at % or more and 20 at % or less. If Dy, an average content of Dy at an interface between the dielectric layer and the internal electrode is within a range of 1 at % or more and 5 at % or less.

Multilayer ceramic electronic component

A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers and external electrodes disposed on the body and connected to the internal electrodes. The one of the internal electrodes includes Ni, Ba, Ti, O, and Tb, and a content of Tb relative to a sum of contents of Ni, Ba, Ti, O, and Tb is 0.45 to 3.0 wt %.

An Fe-based nanocrystalline alloy is represented by Composition Formula, (FeMa)MBPCuM, where Mis at least one element selected from the group consisting of Co and Ni, Mis at least one element selected from the group consisting of Nb, Mo, Zr, Ta, W, Hf, Ti, V, Cr, and Mn, Mis at least two elements selected from the group consisting of C, Si, Al, Ga, and Ge but necessarily includes C, and 0≤a≤0.5, 1.5<b≤3, 10≤c≤13, 0<d≤4, 0<e≤1.5, and 8.5≤g≤12.

Fe-based nanocrystalline alloy and electronic component using the same

A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

Multilayer capacitor and board having the same mounted thereon

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces. A plurality of internal electrodes is disposed inside the ceramic body, connected to the first and second surfaces, and have one ends connected to the third and fourth surfaces. First and second side margin parts are disposed on end portions of the internal electrodes connected to the first and second surfaces. The ceramic body includes an active portion forming capacitance by including the plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween. An average Sn content in a region adjacent to the side margin part of the active portion is greater than an average Sn content in a central region of the active portion.

Multilayer ceramic capacitor

A dielectric ceramic composition includes a base material main component of barium titanate and a subcomponent. A microstructure of the dielectric ceramic composition after sintering includes a first grain having a Ca content of less than 3.5 at % and a second grain having a Ca content of 3.5 to 13.5 at %, and an area ratio of the second grain to an area of the total grains is 70% to 95%.

Dielectric ceramic composition and multilayer ceramic electronic component using the same

A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, external electrodes disposed on the body to be connected to the internal electrodes, and a metal oxide disposed between the body and the external electrodes. The metal oxide includes calcium (Ca), zinc (Zn), and silicon (Si), and further includes at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).

A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (BaCa) (Ti(Zr, Hf))O(where, 0≤x≤1, 0≤y≤0.5), and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode connected to the second internal electrode, wherein at least one of the dielectric layer and the internal electrode includes Sn or Dy. If Sn, an average content of Sn at an interface between the dielectric layer and the internal electrode is within a range of 5 at % or more and 20 at % or less. If Dy, an average content of Dy at an interface between the dielectric layer and the internal electrode is within a range of 1 at % or more and 5 at % or less.

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Gyunggi-do, South Korea

Chang Hak Choi