Industrial Technology Research Institute

Chang-Chih Liu

Li-Chi Chang

Yung-Chung Chang

Cheng-Hua Tsai

Meng-Sheng Chen

Chang-Sheng Chen

Shih-Hsien Wu

Peng-Shu Chen

Hsun Yu

A chip stacking structure including a plurality of microbump structures, a plurality of first substrates, at least one first space layer, a plurality of second substrates and at least one second space layer is provided. The first substrates are stacked upon each other by a portion of the microbump structures, and each of the first substrates includes at least one first redistribution layer. The first space layer is located between the stacked first substrates. The second substrates are stacked on at least one of the first substrates by another portion of the microbump structures, and each of the second substrates includes at least one second redistribution layer. The second space layer is located between the stacked first and second substrates. The first redistribution layers, the second redistribution layers and the microbump structures form a plurality of impedance elements, and the impedance elements provide a specific oscillation frequency.

Chip stacking structure

An RFID sealing device for a bottle is disclosed, which provides information of production resumes, stock control, sale control and so like, where the information may be adapted for a computerized foods management system for the upstream manufacturer and the downstream sellers. Since the metal cap plays a part in the RFID sealing device, the RFID shall malfunction once the bottle cap has been turned or opened before sale, so that the present RFID sealing device plays a function of safety identifier to the bottled liquid or food in addition.

RFID sealing device for bottle

An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.

Inductor structure

An antenna having a signal feeding structure, an antenna conductor coupled to the signal feeding structure and forming a slot in the antenna conductor. A closing portion capacitively closing the at least one slot at a mechanically open end of the slot.

Antenna with slot

A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other.

Growing community of inventors

Taichung, Taiwan

Chang-Chih Liu