Taiwan Semiconductor Manufacturing Comp. Ltd.

Chang Chia How

Hung-Chih Lin

Mill-Jer Wang

Hao Chen

Ching-Nen Peng

Mincent Lee

Chen-Hung Tien

A method of probe testing dies, the method includes loading a wafer having a first die and a second die into a prober and bringing probes of the prober into contact with first contact pads of the first die according to first probe parameters. A first probe contact test of first values of the contact between the probes and the first contact pads is performed, and a die test of the first die is performed after performing the probe contact test. Results of the die test and results of the probe contact test are saved and second probe parameters are automatically generated based on at least the results of the first probe contact test.

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Hsin-Chu, Taiwan

Chang Chia How