Chrysler Corporation

Chandrakant Dave

Frank J Hodges

Alfred H Glover

Terry P Mach

Kurt R Jackson

Joseph T Betterton

Stephen J Morris

Stephen L Morris

Heat is removed from electronic components located within a closed housing by the use of a heat-conducting metal clip mounted on the housing cover so as to be in pressure contact with the electronic components. The metal clip includes a U-shaped mounting portion firmly clamped to a clip-mounting wall projecting from the cover, and a series of spring arms extending through a slot opening in the cover into pressure contact with individual electronic components. The clamp force of the clip on the mounting wall is designed to act independently of the pressure exerted by each spring arm on an associated electronic component.

Mechanism for removing heat from electronic components

A mounting assembly mounts an integrated circuit between a printed circuit board and a lower surface of a heat sink. The mounting assembly includes a plurality of electrical leads extending out from the integrated circuit and toward the printed circuit board. The electrical leads extend in a direction away from the lower surface of the heat sink. A spring is secured to the heat sink and disposed adjacent the printed circuit board and facing the integrated circuit to abut the lower surface of the heat sink such that thermal energy will pass from the integrated circuit to the heat sink.

Mounting assembly for electrical components and heat sinks

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Huntsville, AL, United States of America

Chandrakant Dave