Entegris, Inc.

Varian Semiconductor Equipment Associates, Inc.

Chandra Venkatraman

Carlo Waldfried

Yan Liu

Jakub Rybczynski

Steven Donnell

Yuxuan Liu

Pushkara Rao Varanasi

Julian G Blake

Dale K Stone

David E Suuronen

Lyudmila Stone

Richard A Cooke

I-Kuan Lin

Montray Leavy

Subhash Guddati

Nilesh Gunda

Thines Kumar Perumal

Zhifeng Li

Caleb Minsky

Dennis Radgowski

Scott Sirignano

Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including a pattern of charge dissipation lines on an insulating layer, the lines having a first conductive layer and a second conductive layer and being arranged to define enclosed fields of the insulating layer between the lines.

Electrostatic chuck with a charge dissipation structure

Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, and electrostatic chuck base components prepared by an additive manufacturing technique.

Electrostatic chuck prepared by additive manufacturing, and related methods and structures

A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

Conductive polymeric layers for charge dissipation

Described are techniques for applying a cured polymeric blanket coating onto a surface, specifically for applying a blanket-coated cured polymeric coating onto a surface of a substrate that is useful as an electrostatic chuck for processing semiconductor wafers.

Methods for applying a blanket polymer coating to a substrate

Articles and methods relating to coatings having superior plasma etch-resistance and which can prolong the life of RIE components are provided. An article has a vacuum compatible substrate and a protective film overlying at least a portion of the substrate. The film comprises a fluorinated metal oxide containing yttrium.

Articles coated with fluoro-annealed films

In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising a conductive path covering at least a portion of a workpiece-contacting surface of a gas seal ring of the electrostatic chuck, the conductive path comprising at least a portion of an electrical path to ground; and a main field area of a workpiece-contacting surface of the electrostatic chuck comprising a surface resistivity in the range of from about 10to about 10ohms per square.

High conductivity electrostatic chuck

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Tyngsboro, MA, United States of America

Chandra Venkatraman