Cree Gmbh

Ideal Industries Lighting LLC

Other

Cree Lighting USA LLC

Chandan Bhat

Theodore D Lowes

Mark Youmans

Bernd P Keller

Eric J Tarsa

Claudio Girotto

Shawn Patrick Keeney

Jean-Claude David Ramey DeSugny

Kurt S Wilcox

Benjamin A Jacobson

David R Stone

Julio Garceran

David Stone

Theodore Douglas Lowes

Luminaires are described herein employing waveguides and associated architectures for dynamic alteration of illuminance distribution patterns. The waveguide includes a light extraction component. The waveguide transmits light from a light source to the light extraction component by total internal reflection (TIR). The light extraction component includes one or more reversibly moveable surfaces for altering illuminance distribution patterns of the luminaire in response to one or more forces applied to the light extraction component by a force application assembly of the luminaire.

Waveguide-based light sources with dynamic beam shaping

In view of delamination and other failure mechanisms, bonded assemblies are described herein comprising one or more reinforcement members reducing deflection of the assemblies under applied flexural loads, wherein the reinforcement members do not materially interfere with the functionality of the bonded assemblies. In one aspect, waveguide assemblies are provided. A waveguide assembly, in some embodiments, comprises a waveguide body and light extraction elements bonded to the waveguide body, wherein at least one reinforcement member is coupled to the waveguide assembly at one or more locations to reduce deflection of the waveguide assembly under an applied flexural load.

Bonded optical systems and applications thereof

A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.

Compact optically efficient solid state light source with integrated thermal management

According to one example aspect, a device for venting a luminaire compartment comprises a luminaire compartment disposed between first and second luminaire components and one or more luminaire gaskets maintaining a weather-proof seal about the luminaire compartment. The device further comprises one or more venting tubes traversing the one or more luminaire gaskets such that the one or more venting tubes extend into the luminaire compartment and the one or more venting tubes equalize one or more environmental parameters of the luminaire compartment with one or more environmental parameters of the ambient environment.

Luminaire utilizing gasket vent

Emitter packages are disclosed that can include an insulating layer covering the emitter, such as between the emitter's primary emission surface and a lens or encapsulant. The packages can comprise a submount with an emitter flip-chip mounted such that the diode region is between the emitter's non-insulating and/or conductive substrate and the submount. The submount can then be covered with a thin insulating layer. The same or another insulating layer can cover other electrically active surfaces on the submount. By insulating the electrically active surfaces of the emitter and, in some embodiments, other electrically active surfaces, the package can meet UL8750 class 4 enclosure standards even if it does not meet the lens adhesion criteria. This can enable the use of cheaper and/or more optically efficient materials at the fixture level, since the package itself meets class 4 standards.

LED packages with chips having insulated surfaces

This disclosure related to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads with protruding contact bumps. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at least a contact pad, such that the contact pad is recessed in relation to a surface of the device. Contact bumps are formed in contact with the contact pads, such that the contact bumps protrude beyond the surface and may contact a surface of a submount that the device is meant to be mounted to. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

Wafer level contact pad solder bumping for surface mount devices with non-planar recessed contacting surfaces

A submount-free light emitter package with primary optic and method of fabricating the same are disclosed, these packages and methods comprising a light emitter with an optic. The optic may have a shape, which includes a portion that is wider at a point further from the light emitter than a point which is closer. The method includes a light emitter disposed on a carrier surface with at least one structure at least partially surrounding the light emitter. The encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic.

Growing community of inventors

Goleta, CA, United States of America

Chandan Bhat