Siliconware Precision Industries Co., Ltd.

Chan-Yu Yeh

Yu-Cheng Pai

Yuan-Ping Yeh

Meng-Jou He

Yuan-Chang Ni

An electronic package and a substrate structure thereof are provided, in which a circuit layer and a filling layer are formed on a substrate body in the substrate structure, where the circuit layer has a plurality of conductive traces separated from each other, so that the filling layer is filled between the plurality of conductive traces, and a portion of a surface of the circuit layer and a surface of the filling layer are covered with an insulating protective layer. Therefore, the insulating protective layer is carried by the filling layer, so that the insulating protective layer can be thin, thereby preventing the phenomenon of copper migration from occurring to the substrate structure in subsequent processes.

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Taichung, Taiwan

Chan-Yu Yeh