Eugene Technology Co., Ltd.

Chan-Yong Park

Il-Kwang Yang

Sung-Tae Je

Disclosed is a substrate processing apparatus and method. The substrate processing apparatus includes a process chamber () providing an internal space, in which a process is carried out onto a substrate; a support member () installed in the process chamber () to support the substrate; and a shower head () located above the support member () to supply a source gas toward the support member (), wherein the shower head () includes a first injection surface () located at a position separated from the upper surface of the substrate by a first distance, and provided with outlets of first injection holes () to inject the source gas; and a second injection surface () located at a position separated from the upper surface of the substrate by a second distance being different from the first distance, and provided with outlets of second injection holes () to inject the source gas.

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Icheon-si, South Korea

Chan-Yong Park