Amkor Technology, Inc.

Chan Yok Park

Kyu Won Lee

Sang Hyun Ryu

Yoon Ha Jung

A semiconductor device for use in a printed circuit board is provided. In the semiconductor device, metal pillars are disposed perpendicular to bond pads of a semiconductor die. This configuration eliminates the need to form via holes for the connection of interconnection layers and the bond pads of the semiconductor die, thus simplifying the fabrication procedure of the semiconductor device. In addition, the semiconductor die is embedded in the semiconductor device. Based on this configuration, the use of the semiconductor device in a printed circuit board facilitates the stacking of a plurality of semiconductor dies and can reduce the thickness required for the stack, which make the semiconductor device light in weight and small in thickness and size.

Semiconductor device having insulating and interconnection layers

Disclosed is a method for manufacturing a semiconductor device substrate. A substrate having no bus line and lead-in line is efficiently manufactured. In a step needing an electroplating process, conductive film is temporarily attached to circuit patterns in order to electrically connect all circuit patterns. A plating is formed in desired regions of the circuit patterns with a predetermined thickness in an electroplating method. The conductive film is completely removed while the substrate is manufactured so that the circuit patterns are electrically independent of one another, and the resulting substrate has no bus line and lead-in line.

Growing community of inventors

Seoul, South Korea

Chan Yok Park