Skhynix Inc.

Chan Woo Jeong

Jong Hoon Kim

Han Jun Bae

Ga Hyun No

A semiconductor package includes a molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. The molding member includes an extendible material which includes a first part having a warped shape, a second part extending from one end of the first part to be flat, and a third part extending from the other end of the first part to be flat, where first surfaces of the connectors are exposed at a surface of the molding member and second surfaces of the connectors are coupled to the chip.

Stretchable semiconductor packages and semiconductor devices including the same

A flexible package may be provided. The flexible package may include a flexible molding member including a top surface. The flexible package may include a first chip within the flexible molding member, and including a first top surface. The flexible package may include a second chip within the flexible molding member, and including a second top surface. The first top surface may face away from the top surface of the flexible molding member and the second top surface may face towards the top surface of the flexible molding member.

Flexible packages including chips

A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.

A semiconductor package includes a first substrate including a plurality of first connecting portions disposed thereon, a second substrate disposed on a portion of the first substrate to be adjacent to the first connecting portions and including a plurality of conductive contact rails disposed thereon, and a plurality of conductive cantilevers respectively placed in contact with surfaces of the conductive contact rails so that one end portion of each conductive cantilever is electrically coupled to one of the first connecting portions and the other end portion slides along one of the conductive contact rails.

Semiconductor packages with sliding interconnect structure

A semiconductor package includes a flexible package substrate including a first surface and a second surface, a metal post penetrating the flexible package substrate from the first surface toward the second surface and including a first protrusion that protrudes from the first surface and a second protrusion that protrudes from the second surface, a first semiconductor chip connected to the first protrusion, a second semiconductor chip connected to the second protrusion, a first flexible molding member covering the first semiconductor chip and the first surface of the flexible package substrate, a second flexible molding member covering the second semiconductor chip disposed on the second surface of the flexible package substrate, and an external connection terminal disposed on the second surface of the flexible package substrate.

Growing community of inventors

Chungju-si, South Korea

Chan Woo Jeong