Samsung Electronics Co., Ltd.

Chan-Sik Kwon

Ji-Yeon Han

Jin Wook Jang

Jin Duck Park

Jun-Young Ko

Seok-Won Jeong

Jae-ho Choi

A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.

Crack detection chip and crack detection method using the same

A test apparatus for a semiconductor package comprising an X-ray analyzer acquiring an X-ray image of the semiconductor package and detecting a thickness of the semiconductor package from the X-ray image, and a thermal reaction analyzer applying a voltage to the semiconductor package and detecting a failure position of the semiconductor package using a surface temperature of the semiconductor package and the thickness of the semiconductor package may be provided.

Test apparatus for semiconductor package

Growing community of inventors

Asan-si, South Korea

Chan-Sik Kwon