Intel Corporation

Chan Kim Lee

Telesphor Kamgaing

Bok Eng Cheah

Ping Ping Ooi

Chang-Tsung Fu

Jackson Chung Peng Kong

Kooi Chi Ooi

Howe Yin Loo

Mooi Ling Chang

Khai Ern See

Chee Chun Yee

Wee Hoe

Siang Yeong Tan

Han Kung Chua

Chung Peng Jackson Kong

Say Thong Tony Tan

Lee Fueng Yap

Greg A La Tour

Chow Soon Lim

Choy Mei Yeow

Chung Peng (Jackson) Kong

An electronic device is disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board.

Semiconductor device and system

A semiconductor device and associated methods are disclosed. In one example, a processor die is coupled to a first side of a package substrate, and a memory die coupled to a second side of the package substrate. A system accelerator die is further coupled to the package substrate. In selected examples, the system accelerator die provides performance improvements, such as higher cached memory speed and/or higher memory bandwidth.

Compact semiconductor chip system and method

'Hybrid' transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels.

Hybrid package transmission line circuits

Computer on a stick

Growing community of inventors

Bayan Lepas, Malaysia

Chan Kim Lee