Lg Chem, Ltd

Chan Hyo Park

Hye Won Jeong

Jinho Lee

Kyungjun Kim

Kyoung Hoon Kim

Bora Shin

Hangah Park

Jinyoung Park

Seung Yup Lee

MiRa Im

Sang Woo Kim

Kyung Jun Kim

Kyunghwan Kim

Hye Ran Seong

Se Jin Shin

Dong Hyun Oh

Danbi Choi

Kyoung Ho Ahn

Jung Ho Jo

Chae Won Park

Ye Ji Hong

Yu Na Kim

Su Kyeong Kim

Takashi Kino

Takashi Yamashita

The present disclosure is directed to providing a support substrate for a display device capable of obtaining high transparency while accomplishing thinning and flexibility of an organic EL display device. In view of the above, the present disclosure provides a support substrate for a display device including a TFT glass substrate having a thickness of 10 μm to 150 μm, and a polyimide resin layer having a thickness of 150 nm or less installed in contact with the TFT glass substrate.

Support substrate for display device, organic EL display device, and manufacturing method for organic EL display device

According to the present invention, a stack comprises, between a carrier substrate and a flexible substrate layer, a peeling power adjustment layer comprising polyimide, which has a refractive index higher than that of the flexible substrate layer, so that a flexible substrate can be more easily peeled from a carrier substrate layer, and thus a flexible element can be manufactured without damage to the element through a simpler process.

Stack for manufacturing flexible element and method for manufacturing flexible element by using same

The present invention relates to a polyimide precursor composition, and a polyimide film manufactured using same. According to the present invention, since a polyimide film is manufactured from a mixture of a polyimide precursor having a structure that is advantageous to surface charge accumulation and a polyimide precursor having a structure capable of exhibiting high heat-resistant characteristics, a flexible device using the polyimide film as a substrate can have both improved charge accumulation characteristics caused by an electric field to be generated during the operation of a TFT device and heat high heat-resistant characteristics.

Polyimide precursor composition and polyimide film manufactured using same

The present disclosure relates to a polyimide-based resin film which is synthesized by the reaction of an acid anhydride compound having a specific structure and a diamine compound, thereby capable of ensuring excellent optical properties even under high temperature heat treatment conditions, and stably maintaining optical properties even during further heat treatment, a substrate for display device, and an optical device using the same.

Polyimide-based polymer film, substrate for display device, and optical device using the same

Provided according to the present invention is a substrate for a flexible display device in which the problems of threshold voltage shift-induced current fluctuation and resultant image sticking can be solved by introducing an imide monomer as an organic filler into a polyamic acid composition to enhance thickness and surface direction densities in the film that is manufactured while vulcanization is performed at high temperatures, thereby enhancing thermal diffusivity and thermal conductivity of the film.

Polyimide film having improved thermal conductivity and manufacturing method therefor

A polyimide film according to the present invention can be effectively used as a substrate for a flexible display device without a deterioration in heat resistance even at a temperature of 350&#xb0; C. or higher since a coefficient of thermal expansion (A) in the section of 100-350&#xb0; C., of the polyimide film, and a coefficient of thermal expansion (B) in the section of 350-450&#xb0; C., of the polyimide film, meet 0&#x3c;B/A&#x3c;2.

Polyimide film for flexible display device substrate

A method for producing a device substrate by obtaining a laminate comprising a carrier substrate with a first polyimide film disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film, applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the adhesive strength of the first polyimide to the second polyimide film decreases and separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device.

Laminate, and element comprising substrate manufactured using same

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

Laminite, and element comprising substrate manufactured using same

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200&#xb0; C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin having a similarity score not greater than 0.5, as calculated by Equation 1 defined in the detailed description, between a carrier substrate and a flexible substrate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same

The present invention relates to polyimide or precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive resin composition including the same. The polyimide or precursor thereof are fabricated using diamine comprising polyalkyleneoxide. The photosensitive resin composition of the present invention has excellent light transmissivity, an excellent resolution, and excellent photo sensitivity and image forming performance. Further, the photosensitive resin composition has high adhesiveness with substrates, such as a silicon film, a silicon oxide film, and a metal film. In particular, an excellent film without failure, such as crack, can be formed.

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Daejeon, South Korea

Chan Hyo Park