Samsung Electro-mechanics Co., Ltd.

Chan Hoon Ko

Sang Hoon Kim

Yoong Oh

Hea Sung Kim

Hee Sung Jun

Won Kyu Jang

Ki Hee Cho

A printed circuit board includes a first insulating layer, a metal pad including a first metal portion disposed on the first insulating layer, and a second metal portion disposed on the first metal portion and integrated with the first metal portion without a boundary therebetween, the second metal portion having a width narrower than a width of the first metal portion on a cross section, a second insulating layer disposed on the first insulating layer and covering at least a portion of a side surface of the first metal portion, and a surface metal layer disposed on the metal pad and covering at least a portion of each of an upper surface and a side surface of the second metal portion.

Printed circuit board

A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

A printed circuit board includes an insulating layer; and an external connection pad embedded in the insulating layer and having one surface exposed. The external connection pad may include a base pad portion having a first pattern portion in contact with a side surface of the insulating layer and having a first width, and a second pattern portion protruding from the first pattern portion and having a second width smaller than the first width, the second pattern portion having a gap with the side surface of the insulating layer, and a surface treatment layer disposed in the gap between the second pattern portion and the insulating layer and extending on an upper surface of the second pattern portion.

Printed circuit board and electronic component package

A printed circuit board includes a substrate including an external connection pad; and a metal post extending to the outside of the substrate in a thickness direction of the substrate from the external connection pad. The metal post may include a first post portion, elongated while having a substantially constant width, a second post portion extending to the outside of the substrate in the thickness direction of the substrate while having a narrow width, and a third post portion extending to the outside of the substrate in the thickness direction of the substrate from the second post portion while having substantially the same width as the first post portion. The third post portion may forma lower end portion of the metal post.

A camera module is provided. The camera module includes: a housing; a lens barrel disposed in the housing; a cover screen disposed over the lens barrel; a blade pivotably coupled to the cover screen and configured to have at least a portion in contact with a surface of the cover screen; and a rotation member disposed on the blade and configured to pivot the blade with respect to the cover screen.

Growing community of inventors

Suwon-si, South Korea

Chan Hoon Ko