Samsung Display Co., Ltd.

Chan Ho Moon

Seung Wook Kwon

Woo Yong Sung

Oh June Kwon

Jeong Seok Lee

Doo Hwan Kim

Min Sang Kim

Won Je Cho

Hyo Jeong Kwon

Jung Han Seo

Seung Yong Song

Sung Hoon Yang

A display device includes a via layer disposed on a substrate and including a via groove having a shape recessed from a first surface to a second surface of the via layer. A first electrode is disposed on the first surface. A pixel-defining film is disposed on the via layer and the first electrode. A first pixel-defining film through-hole passes through the pixel-defining film in a thickness direction and exposes the first electrode. A second pixel-defining film through-hole passes through the pixel-defining film in the thickness direction. The second pixel-defining film through-hole is spaced apart from the first pixel-defining film through-hole and overlaps the via groove. An emission layer is disposed on an exposed portion of the first electrode. A protrusion is disposed on the pixel-defining film and includes a protrusion through-hole which passes through the protrusion in the thickness direction and overlaps the second pixel-defining film through-hole.

Display device and method of manufacturing the same

A display device includes a first electrode disposed on a substrate, a pixel defining layer exposing at least a part of the first electrode and disposed on the substrate, a light emitting layer disposed on the first electrode, a second electrode disposed on the light emitting layer, and an encapsulation layer disposed on the second electrode, wherein the pixel defining layer includes an overlapping area overlapping the first electrode and a non-overlapping area not overlapping the first electrode, the overlapping area includes a first overlapping area spaced apart from the first electrode and facing the first electrode, and the encapsulation layer is at least partially disposed in a space between the first electrode and the pixel defining layer in the first overlapping area.

A display device includes a display panel including a main area, a bending area at which the display panel is bendable, and a sub area, in order. The main area includes a display area and a non-display area which is adjacent to the display area. The bending area connects the sub area to the main area at the non-display area thereof, and is recessed from outer side surfaces of the main area and the sub area, to define a recess portion of the display panel at the bending area.

Bending area side surface protective layer and display device having the same

A method of manufacturing a display device includes providing a display panel including a folding area at which the display panel is foldable, and a flat area which is adjacent to the folding area; providing a protective film on both the flat area and the folding area of the display panel; removing a portion of the protective film which corresponds to the folding area, from the display panel, to expose the folding area outside a remaining portion of the protective film, where the remaining portion of the protective film defines a bump of the protective film at a portion of the flat area which is closest to the folding area; and removing a portion of the bump from the portion of the flat area.

Apparatus for removing bump of display device and method of manufacturing display device using the same

Display device having recessed bending area

A display device includes a flexible substrate including a bending area corresponding to an area at which the display device is bent, and a first area and a second area which is spaced apart from the first area by the bending area, a display element unit disposed in the first area of the flexible substrate; and a buffer member disposed in the bending area of the flexible substrate. The buffer member in the bending area includes: a first buffer member having a first maximum thickness, and a second buffer member having a second maximum thickness which is smaller than the first maximum thickness. Among the first buffer member and the second member, the first buffer member disposed closer to the first area and the second member disposed closer to the second area.

Growing community of inventors

Busan, South Korea

Chan Ho Moon