Teledyne Scientific and Imaging, LLC

Chailun Tsai

Jeffrey DeNatale

Philip Stupar

Robert L Borwick, Iii

John White

Les Warren

Morgan Tench

Zhimin J Yao

Kathleen Garrett

Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.

Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method

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Thousand Oaks, CA, United States of America

Chailun Tsai