Infineon Technologies Ag

Chai Wei Heng

Wae Chet Yong

Khai Huat Jeffrey Low

Stanley Job Doraisamy

Gerhard Deml

Yang Hong Heng

Yong Chern Poh

A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.

Method of fabricating a semiconductor device having a resin with warpage compensated structures

An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered.

Electronic component and a method of fabricating an electronic component

Semiconductor devices having a resin with warpage compensated surfaces

There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.

Method of manufacture of encapsulated package

Growing community of inventors

Melaka, Malaysia

Chai Wei Heng