Apple Inc.

Chae Hyuck Ahn

Dariusz Golda

Hyeun-Su Kim

Andreas Bibl

Clayton K Chan

Eric B Newton

Kevin T Huang

Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

High density pick and sequential place transfer process and tool

Donor substrate micro device stabilization structures and display structures are described. In an embodiment, a patterned electrically conductive layer is used to stabilize an array of micro devices on donor substrate with a plurality of tethers, which can be broken during a transfer sequence to transfer the array of micro devices from the donor substrate.

Nano-tether micro LED structure

Growing community of inventors

Campbell, CA, United States of America

Chae Hyuck Ahn