Tyco Electronics Corporation

Te Connectivity Corporation

Te Connectivity Solutions Gmbh

Tyco Electronics Japan G.k.

Tyco Electronics (Shanghai) Co., Ltd.

Te Connectivity Services Gmbh

Te Connectivity Germany Gmbh

Te Connectivity Nederland Bv

Tyco Electronics Belgium Ec Bvba

Te Connectivity Japan G.k.

Connectivity, Inc.

Tyco Electronics Co., Ltd.

Chad William Morgan

John Joseph Consoli

Timothy Robert Minnick

David Wayne Helster

Justin Dennis Pickel

David Allison Trout

Alex Michael Sharf

Bruce Allen Champion

Douglas Wade Glover

Craig Warren Hornung

Brent Ryan Rothermel

David Patrick Orris

Masayuki Aizawa

James Lee Fedder

Liang Huang

Hiroshi Shirai

Jeffrey Byron McClinton

James Myoungsoo Jeon

Wayne Samuel Davis

Lynn Robert Sipe

Michael James Horning

Nathan Lincoln Tracy

Brian Patrick Costello

Douglas Edward Shirk

Evan Charles Wickes

Arturo Pachon Munoz

Michael Streckewald

Attalee Snarr Taylor

Linda Ellen Shields

John Edward Knaub

Margaret Mahoney Fernandes

Rodney Ivan Martens

Masaaki Iwasaki

Leo Joseph Graham

Megha Shanbhag

Michael Joseph Vino, Iv

Megan Hoarfrost Beers

Lucas Arthur Benson

Vincent Ruminski

Hirotate Kadobayashi

Shinichi Hashimoto

Michael David Herring

David Bruce Sarraf

Justin Shane McClellan

Ting Gao

George R Defibaugh

Martin William Bayes

Charles Sands Pickles

Arash Behziz

Julia Anne Lachman

Matthew Jeffrey Sypolt

Yoshihiko Kodaira

Nathan William Swanger

Dharmendra Saraswat

Daniel Briner Shreffler

Aakriti Kharel

Gokce Gulsoy

Douglas Edward Lawrence

Lei Wang

Matthew Richard McAlonis

Robert Neil Mulfinger

Christopher William Blackburn

Naoki Hashimoto

Keith McQuilkin Murr

Scott Keith Mickievicz

Sandeep Patel

James Charles Shiffler

Rutger Wilhelmus Smink

Jeffrey Stewart Simpson

Thomas Taake De Boer

Christian Rusch

Lieven Decrock

Carlos Almeida

Nancy Lee Reeser

Dirk R Dixon

Clarence Leon Yu

Raymond Dennis Boyer

Peter Clark O'Donnell

Robert Frederick

Kenneth William Ellis

Mark Wartenberg

Jialing Wang

Jessica H B Hemond

Alexander Michael Sharf

Edward Lee Hengst

Markus Dittmann

Jevon Ryan Corban

David W Heister

Thomas Edward Messenger

Andrew Michael Homick

Peter Cherok

Andy M Homick

Paul Hollis

Michael William Woodford

Liang (Vincent) Huang

Ranjan Deepak Deshmukh

Jennifer Love

Howard W Andrews

Suvrat Bhargava

A cable assembly includes a cable having a cable shield surrounding an insulator and first and second signal conductors with exposed portions at the end of the cable coupled to a circuit card. The cable has a drain wire exposed at the end of the cable. The cable assembly includes a ground clip coupled to the end of the cable having a bottom ground rake below the cable and a top ground hood above the cable. The bottom ground rake includes a lower grounding tab electrically connected to a lower portion of the cable shield and the top ground hood includes an upper grounding tab electrically connected to an upper portion of the cable shield. The top ground hood includes a cable connector coupled to the end of the cable. The cable connector pressing the drain wire toward the cable shield.

Cable assembly for a cable connector module

An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is adjusted to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.

Electrical connector using tunable hot melt adhesive material

An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is lowered to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.

A cable connector module includes a circuit card having signal contact pads on an upper surface and signal mating pads on a lower surface configured to be mated with interposer contacts of a socket connector. Signal vias extend directly through the circuit card electrically connecting the signal contact pads and the corresponding signal mating pads in the shortest path possible. The cable connector module includes cable assemblies terminated to the upper surface having a cable and a ground structure coupled to an end of the cable.

A cable assembly includes a cable having signal conductors and a cable shield. The cable may have drain wires at sides of the cable. A ground clip is coupled to the end of the cable having a window that receives the exposed portions of the signal conductors therethrough. The ground clip is coupled to the circuit card to support the cable relative to the circuit card. The ground clip includes a lower grounding tab electrically connected to a lower portion of the cable shield and an upper grounding tab electrically connected to an upper portion of the cable shield. The ground clip includes connecting tines electrically connected to sides of the cable shield, such as via the drain wires.

A wafer assembly includes a leadframe having signal contacts and cables with signal conductors terminated to the corresponding signal contacts. Each cable includes a cable shield providing shielding for the signal conductors. The wafer assembly includes a wafer body holding the signal contacts. The wafer assembly includes first and second ground frames coupled to the first and second sides of the wafer body to provide electrical shielding for the leadframe. The ground frames include ground shields providing shielding for mating ends of the corresponding signal contacts. The ground frames includes cable covers coupled to the corresponding cable shields.

Wafer assembly for electrical connector assemblies

An electrical connector having a housing with a first surface and a second surface. Contact receiving openings extend from the first surface to the second surface. Contacts are positioned in the contact receiving openings. The contacts have base members and resilient contact beams extending from opposed sides of the base members. Sidewalls extend from opposed sides of the base members from which the resilient contact beams do not extend. The contacts also provide multiple electrical pathways across the contacts for electrical signal transmissions, allowing for signal transmissions to be transmitted at frequencies of approximately 224 Gbps or greater.

IC socket with high speed contacts

An electronic assembly includes a socket assembly including a cage mounted to a circuit board and a socket connector received in a cavity of the cage. The socket connector includes a substrate holding interposer contacts with compressible upper and lower contact portions. The electronic assembly includes a cable connector module received in the cavity of the cage and coupled to the socket connector. The cable connector module includes a housing coupled to the cage, a circuit card received in the cavity of the housing, and cable assemblies coupled to the circuit card. The circuit card is coupled to the socket connector.

Electronic assembly having a cable connector module

A circuit board assembly includes a circuit board and an electrical connector having a connector housing holding contacts in a contact array. The connector housing has a mating end configured to be mated with a mating electrical connector in a mating direction. The electrical connector has cables terminated to the contacts and extending from a cable end. A connector mount is used to locate the electrical connector relative to the circuit board. A bracket is coupled to the mounting surface of the circuit board. A biasing member is coupled to the bracket and the mounting feature and is compressible along a compression axis parallel to the mating direction to allow the electrical connector to float in the mating direction relative to the circuit board.

Circuit board assembly for a communication system

A socket connector includes a substrate having signal and ground contact channels between upper and lower surfaces and ground bar slots. The socket connector includes signal socket contacts received in signal contact channels and ground socket contacts received in ground contact channels. The socket connector includes ground bars received in corresponding ground bar slots. The ground bars electrically connect the corresponding ground socket contacts.

Socket connector

An electrical connector including a housing defining an interior cavity and extending from a mounting end to an engagement end, and at least one signal component disposed within the interior cavity of the housing. The housing is formed from a conductive composite material and engages the at least one signal component to shield the interior cavity.

High speed connector with moldable conductors

A separable connector interface includes at least one electrically conductive element with a metal polymer composite deposited thereon. The metal polymer composite has conductive particles dispersed within a protective binder.

Metal composite for use with separable electrical interfaces

An electrical connector assembly includes a housing having a mating interface configured to be mated with a hermaphroditic mating electrical connector assembly. The housing includes an electrically conductive commoning member having contact openings. Wafer assemblies are coupled to the housing each having a leadframe, a wafer body holding the leadframe, and a ground frame providing electrical shielding for the leadframe. The signal contacts are terminated to cables. The ground shields are electrically connected to the commoning member. The mating ends of the signal contacts and the ground shields form a hermaphroditic mating interface for mating with the hermaphroditic mating electrical connector assembly.

Direct plug hermaphroditic electrical connector assemblies

A socket connector includes a substrate having an upper surface and a lower surface. The substrate has a ground plane between the upper surface and the lower surface. The substrate includes contact channels between the upper and lower surfaces. The socket connector includes socket contacts received in corresponding contact channels. Each socket contact includes a contact body, an upper mating element, and a lower mating element. The upper mating element is deflectable relative to the contact body and extends to the upper surface to interface with a first electrical component. The lower mating element is deflectable relative to the contact body and extends to the lower surface to interface with a second electrical component. A plurality of the socket contacts are electrically connected to the ground plane.

The present invention relates to metallic structure with desired combinations of mechanical and electrical characteristics formed of a higher electrical conductivity element with a mechanically stronger element.

Metallic structure with desired combinations of mechanical and electrical characteristics

Growing community of inventors

Carneys Point, NJ, United States of America

Chad William Morgan