Xerox Corporation

Palo Alto Research Center Inc.

Chad Steven Smithson

Kurt I Halfyard

Naveen Chopra

Michelle Chretien

Sarah Jane Vella

Barkev Keoshkerian

Guiqin Song

Yujie Zhu

Adela Goredema

Biby Esther Abraham

Johann Junginger

Ethan Shen

Tianxiao Xu

Yiliang Wu

Janos Veres

Michelle N Chrétien

Antonio St Clair Lloyd Williams

Hojjat Seyed Jamali

Gail Song

Shiping Zhu

Ethen Shen

The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

Hybrid nanosilver/liquid metal ink composition and uses thereof

An method for operating an object printing system printer prints electrical circuits on non-planar areas of objects and accurately places electronic components within the printed circuits. The method includes operation of a direct-to-object printer to form an electrical circuit on an object secured within the direct-to-object printer and operation of an electronic component placement system to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to a generation of a signal by the direct-to-object printer for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.

Method for forming electrical circuits populated with electronic components on non-planar objects

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

Adhesive composition comprising metal nanoparticles

A method for producing flexible conductive printed circuit with a printed overcoat is disclosed. For example, the method includes forming conductive printed circuit lines on a flexible substrate, detecting locations on the flexible substrate where the conductive printed circuit lines are formed, and printing an overcoat over the conductive printed circuit lines at the locations that are detected on the flexible substrate, wherein the overcoat comprises a mixture of thermoplastic polyurethane (TPU) and a solvent having a viscosity of 1 centipoise to 2,000 centipoise to allow the mixture to be printed.

Flexible conductive printed circuits with printed overcoats

A temperature sensitive ink composition including a metal oxide nanoparticle; a binder; a solvent; an optional dispersant; and an optional surfactant; wherein the ink composition is a thermistor ink that exhibits a change in resistance which is dependent on temperature. A process for preparing the ink composition. A process including depositing the ink composition onto a substrate to form deposited features; and optionally, heating the deposited features on the substrate to form temperature sensitive features on the substrate, wherein depositing can include ink jet printing or aerosol jet printing.

Temperature sensor ink composition with metal oxide nanoparticles

There is described is described a modular point-of-purchase display, system and method. The modular point of purchase display includes a back wall and a front wall, a bottom wall, at least one side wall, and at least one shelf. A printed electronic device is affixed to a surface of the back wall, the front wall, the bottom wall, the at least one side wall, and the at least one shelf. The display includes a microcontroller electrically coupled to the printed electronic device. The display includes a power supply electrically coupled to the printed electronic device. The display includes a connection device coupled to the printed electronic device. The display includes a modular component coupled to the connection device, wherein the modular component can be removed and replaced with an alternate modular component compatible with the connection device.

Modular point-of-purchase (POP) display

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

Adhesive composition comprising eutectic metal alloy nanoparticles

Disclosed herein as a printing method and system which includes providing a substrate and depositing an interlayer composition including a polymer selected from the group of epoxy resins, polyvinyl phenols and poly(melamine-co-formaldehyde) and an interlayer composition solvent on the substrate. The interlayer composition is cured to form cured interlayer. A conductive metal ink composition is deposited on the cured interlayer and the conductive metal ink composition is cured to form a solid metal trace on the cured interlayer.

Interlayer printing process

An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.

System for forming electrical circuits on non-planar objects

Disclosed herein is a printing method for forming a three dimensional article. The method includes providing a first 3D structural material; depositing a metal nanoparticle ink composition on a surface of the first 3D structural material; annealing the metal nanoparticle ink composition at a temperature of between 60&#xb0; C. and 100&#xb0; C. to form the conductive article on the first 3D structural material; and optionally forming a second 3D structural material over the conductive article.

Conductive three-dimensional articles

There is described a point-of-purchase display and method. The display includes one or more sheets. The one or more sheets when unfolded and assembled form the display. The display includes a back wall, a front wall, at least a side wall and a bottom wall. A printed electronic device is affixed to a surface of the one or more sheets. The printed electronic device is selected from the group consisting of: wires, insulators, resistors, capacitors, inductors, transformers, transistors, antennas, OLEDs and sensors. A microcontroller electrically is coupled to the printed electronic device. A connection device is coupled to the printed electronic device. A modular electronic component is coupled to the connection device.

Point-of-purchase (POP) display

Aqueous ink compositions and methods for fabricating a resistive material for a printed circuit are provided. The aqueous ink composition may include an aqueous solvent, one or more carbon nanoparticles, and one or more cellulose nanocrystals. The one or more carbon nanoparticles may include carbon nanotubes, such as multi-walled nanotubes, and the one or more cellulose nanocrystals may include cellulose nanocrystals functionalized with carboxylate groups.

Aqueous carbon nanoparticle ink composition for resistors

An ink composition including a metal salt amine complex; wherein the metal salt amine complex is formed from a metal salt and an amine; a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator; and an optional solvent. A process including forming a metal salt amine complex; adding a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator to the metal salt amine complex to form an ink. A process forming conductive features on a substrate with the ink composition.

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Toronto, Canada

Chad Steven Smithson