Novellus Systems Incorporated

Akrion Systems, LLC

Chad Michael Hosack

Steven T Mayer

Bryan L Buckalew

Thomas Anand Ponnuswamy

Lee Peng Chua

John A Korbler

Mark Rouillard

James Brown

Brian Paul Blackman

Pejman Fani

Robert Rash

David W Porter

Santosh Kumar

Fani Pejman

Disclosed are pre-wetting apparatus designs and methods for cleaning solid contaminants from substrates prior to through resist deposition of metal. In some embodiments, a pre-wetting apparatus includes a process chamber having a substrate holder, and at least one nozzle located directly above the wafer substrate and configured to deliver pre-wetting liquid (e.g., degassed deionized water) onto the substrate at a grazing angle of between about 5 and 45 degrees. In some embodiments the nozzle is a fan nozzle configured to deliver the liquid to the center of the substrate, such that the liquid first impacts the substrate in the vicinity of the center and then flows over the center of the substrate. In some embodiments the substrate is rotated unidirectionally or bidirectionally during pre-wetting with multiple accelerations and decelerations, which facilitate removal of contaminants.

Methods and apparatus for wetting pretreatment for through resist metal plating

Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle.

Methods and apparatuses for cleaning electroplating substrate holders

A method for processing flat articles with acoustical energy. The inventive system method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a method for processing flat articles wherein a liquid is applied to both major surfaces of the flat article. A first transducer assembly is positioned adjacent to a first of the major surfaces of the flat article and a second member is positioned adjacent to a second of the major surfaces. The first transducer assembly generates and transmits acoustical energy to the first major surface of the flat article while the second member either: (1) reflects the acoustical energy generated by the first transducer assembly back to the second major surface of the flat article; and/or (2) generates and transmits acoustical energy to the second major surface of the flat article.

Method for processing flat articles

A system, apparatus and method for processing flat articles with acoustical energy. The inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a system and/or method for processing flat articles wherein a liquid is applied to both major surfaces of the flat article. A first transducer assembly is positioned adjacent to a first of the major surfaces of the flat article and a second member is positioned adjacent to a second of the major surfaces. The first transducer assembly generates and transmits acoustical energy to the first major surface of the flat article while the second member either: (1) reflects the acoustical energy generated by the first transducer assembly back to the second major surface of the flat article; and/or (2) generates and transmits acoustical energy to the second major surface of the flat article.

Acoustic energy system, method and apparatus for processing flat articles

A system, apparatus and method for processing flat articles, such as semiconductor wafers, with acoustical energy. In a cleaning process, the inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a system for processing flat articles comprising: a first dispenser for applying a liquid to a first surface of a flat article; a second dispenser for applying liquid to a second surface of a flat article; a first transducer assembly positioned so as to transmit acoustical energy to the first surface of the flat article; and a second transducer assembly positioned so as to transmit acoustical energy to the second surface of the flat article.

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Tigard, OR, United States of America

Chad Michael Hosack