Micro Control Company

Veeco Instruments Inc.

Chad Michael Conroy

Harold E Hamilton

Brian R Bloch

Scott Wayne Priddy

Mark W Greenwood

The present invention provides deposition sources, systems, and related methods that can efficiently and controllably provide vaporized material for deposition of thin-film materials. The deposition sources, systems and related methods described herein can be used to deposit any desired material and are particularly useful for depositing high vapor pressure materials such as selenium in the manufacture of copper indium gallium diselenide based photovoltaic devices.

Deposition of high vapor pressure materials

A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment below the valve tray. Each valve tray has a plenum formed above it to provide a separate chamber that is a source of cooling air. Each valve tray has a plurality of valves, one over each of a number openings in the tray. Each opening overlies an integrated circuits or device under test on the burn-in-board below the valve tray. The valves control the flow of air for cooling the integrated circuits. The flow of air through the valves is the only path for cooling airflow to the integrated circuits on the burn-in-boards.

Cooling air flow control valve for burn-in system

A burn-in oven is provided with a wall that has a number of vertically stacked, laterally extending slots aligned with each of the burn-in-board supports in the oven. When a burn-in-board is placed in the oven on the supports, an edge portion of the burn-in-board extends through a slot into a connector area. Each of the slots has a shutter associated therewith that will move from an open position to permit the burn-in-board connector portion to extend through the slot, to a closed position wherein the shutter covers the slot. A cam operator moves the shutters to a closed position, except when a burn-in-board is extending through a particular slot, it will support the shutter in its open position and the shutter will not be moved by the cam. All the shutters associated with openings through which no burn-in-board connector portion extends will be closed to prevent air flow from the burn-in oven.

Shutters for burn-in-board connector openings

A holder for holding an integrated circuit device to be tested in contact with a contact set on a circuit board has a support base that supports a contact set circuit board, and a hinged cover that will move between an open and a closed position. The hinged cover is pivotally mounted on a vertically slidable frame. The frame is cam actuated to move the frame and cover toward and away from the base. When the cam operator is moved to move the cams, to in turn move the frame and cover away from the base, a portion of the cam operator engages an arm on the cover and pivots the cover to an open position. The cover can easily be moved to its closed position manually and then the cam operator becomes accessible for operating the cams to clamp the integrated circuit to be tested against a contact set printed circuit board on the support base.

Hinged heat sink burn-in socket

A test and burn-in socket assembly designed to hold an integrated circuit module during testing or burn-in has a base that mounts a printed circuit connection board. The base has a central opening in which the integrated circuit module can be inserted. A pair of locking arms that will engage and clamp the integrated circuit module onto the printed circuit board are supported on a movable frame that is movable toward and away from the base. The arms are moved between clamping and release positions as the movable frame is moved. The movable frame is actuate by cams that are simultaneously moved by a handle or bail. The clamping arms are controlled so that they will move perpendicular to the integrated circuit when they are close to the board and move laterally to provide a space for installing and removing a board from its installed position. The board that has been tested to be removed and a new board to be inserted.

Test and burn-in socket clamping mechanism

A rack for supporting a plurality of burn-in boards and thermal boards which carry heat sinks to be associated with circuit chips mounted on the burn-in boards, has a first side frames that support the burn-in boards in a fixed position. Movable frames adjacent each of the side frame have a plurality of supports for thermal boards which include heat sinks, temperature sensors and other components. The movable frames are slidably mountable in a direction perpendicular to the burn-in board. Cams control the movement of the movable frames so that the thermal boards and components carried thereby can be moved from a position clearing the burn-in boards to permit insertion of the burn-in boards, onto the rack to a position wherein the components contact chips on the burn-in boards for good thermal control of the circuits on the burn-in boards.

Growing community of inventors

Stillwater, MN, United States of America

Chad Michael Conroy