Xerox Corporation

Chad Johan Slenes

John Richard Andrews

Jonathan Robert Brick

Chad David Freitag

Samuel Vincent Schultz

Peter Johan Nystrom

Bradley James Gerner

Richard Schmachtenberg, Iii

Jon Garret Judge

Mark Anthony Cellura

Gary Daniel Redding

Dan Leo Massopust

William Bruce Weaver

David Lyell Knierim

Tony Russell Rogers

David R Koehler

Ivan Andrew McCracken

Steven Ross Slotto

Garry A Jones

Christopher Jon Laharty

Nasser Alavizadeh

Shawn Michael Close

Tygh James Newton

Terrance Lee Stephens

Ronald F Burr

Eric C Segerstrom

Sharon S Berger

John Milton Brookfield

James Maxwell Stevenson

Steven V Korol

Christine M Greiser

Britton T Pinson

Curtis Douglass Keller

Scott Taylor Treece

Jim Stevenson

Lee M Oien

Joshua E Lake

David J Finnie

Paul A Boeschoten

Steven R Slotto

Dan L Massopust

Richard Schmachtenberg Iii

A printer includes print heads configured to eject ink drops onto print media to form images, a controller connected to the print heads to control the print heads to eject ink drops to form the images including one or more test images, one or more actuators to cause the print media to pass the print heads, and at least one camera to capture one or more optical images of the print media after the print media passes the print heads, the controller to detect the test images in the optical images and to measure print characteristics in the test image. A method of measuring ink jet print head alignment includes capturing one or more optical images of media containing printed images, detecting optical images that contain specific printed test images, and measuring print characteristics based upon image data derived from the specific printed test images.

Print head angle and stitch alignment during full speed printer operation

An inkjet printer includes one or more printhead maintenance stations. Each station is positioned within the print zone of the inkjet printer and includes at least one printhead cleaning module. The at least one printhead cleaning module is configured to move from a first position that is not between the media transport and the at least one printhead to a second position where the at least one printhead cleaning module is between the at least one printhead and the media transport.

System and method for storing printhead cleaning modules in a print zone of an inkjet printer

A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.

Method of forming an electrical interconnect

An inkjet printing system, including an inlet in a print head to receive ink from an ink supply, a plurality of nozzles to eject ink in the print head, an ink pressure sensor disposed in an ink path, the ink pressure sensor configured to determine an ink pressure of the ink in the print head and output a signal indicating the ink pressure, and a controller in the print head configured to receive and process the signal indicating the ink pressure from the ink pressure sensor. The inkjet printing system may also include a memory to store an ink pressure and time profile. The controller may also output a signal to stop ejecting ink from the plurality of nozzles when the ink pressure is either below a negative threshold or above a positive threshold.

Print head having ink pressure sensor

A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Raised fluid pass-through structure in print heads

An electrical interconnect has a circuit substrate and an electrical connection point on the circuit substrate. The electrical connection point includes a lattice of conductive material that is adjacent a gap in the circuit substrate and has anchor points that are attached to the circuit substrate. In some configurations, a conductive epoxy encapsulates at least a portion of the lattice of conductive material and may include a second electrical connection point that is bonded to the other electrical connection point through the conductive epoxy.

Suspended lattice for electrical interconnects

A printhead for a printer and methods for making the printhead. The printhead may include a driver module on a jetstack. The jetstack may include a plurality of holes formed therethrough. A first adhesive layer may be disposed on the jetstack. A diaphragm plate may be disposed on the first adhesive layer. A piezoelectric layer may be disposed on the diaphragm plate. A second adhesive layer may be disposed on the piezoelectric layer. A chip on flex may be disposed on the second adhesive layer.

Modular printhead sub-assembly

A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

Flex circuit board with topographical structures to facilitate fluid flow through the layer

An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.

Method of making an electrical circuit structure

A heater for use in a phase change ink printhead reservoir is provided that includes a first insulating layer having at least one ink supply path opening, and a second insulating layer having at least one ink supply path opening that aligns with the at least one ink supply path opening in the first insulating layer. The heater includes a resistance heating trace arranged in a serpentine pattern between the first and the second insulating layers. The resistance heating trace is configured to receive electric current and to convert the electric current to heat. The resistance heating trace includes a trace ring for each ink supply path opening in the first and second insulating layers that forms a continuous perimeter around the corresponding ink supply path opening.

Heat element configuration for a reservoir heater

A check valve unit is provided for a high-speed phase change ink image producing machine between a reservoir for receiving and holding a volume of melted ink from a source and a receiving unit, which may be a printhead system. The check valve unit includes a plurality of ball elements trapped between upper and lower housings defining a like plurality of inlet and discharge passageways. The passageways are configured to optimize flow of melted ink through the unit during charging of the secondary reservoir. The check valve unit is scalable as to size and number of reservoirs for a particular application. The unit further incorporates features that simplify the manufacturing and assembly process while maintaining optimal performance.

Check valve unit for solid ink reservoir system

Exemplary embodiments provide interconnects and methods for interconnecting an electrical device array with a flexible circuit by filling a chemically-etched or laser-ablated integral stencil with conductive materials.

Interconnection method for tightly packed arrays with flex circuit

Growing community of inventors

Sherwood, OR, United States of America

Chad Johan Slenes